Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered in Shanghai, with operations and partnerships spanning key international markets. The company focuses on DRAM memory modules and data processing solutions for cloud computing and data center markets, addressing the soaring demand for high-bandwidth and large-capacity memory driven by artificial intelligence (AI) and enterprise workloads. Its product portfolio includes Memory Interface chips, Memory Module Controller ICs, PCIe Retimer chips, and more.Driven by the increasing demand for generative AI, machine learning, big data analytics, datacenter construction, one of the recent product development trends of Montage Technology is aiming the Compute Express Link® (CXL®) technology, which enables high-speed interconnect between CPUs and DRAM memory, addressing memory challenges by enhancing system performance, scalability, and cost-efficiency. Built on the PCIe physical layer, CXL introduces innovative capabilities such as DRAM memory expansion, sharing, pooling, and dynamic configuration, effectively eliminating traditional data processing bottlenecks in data-intensive systems and data center servers.In this interview, Geof Findley, World Wide VP of Sales & Business Development at Montage Technology, discusses the recent advancements in memory technologies aimed at increasing datacenter performance. Montage delivers versatile memory solutions that unlock next-gen memory bandwidth and performance, specifically tailored for AI and data-intensive workloads. These solutions are already in use by major global DRAM manufacturers and electronics OEMs/ODMs, underscoring strong partnerships with companies such as SK hynix, Samsung Electronics and Micron Technology.Credit: Montage TechnologySpecialty memory buffers and MRDIMM modulesWith more than 20 years of experience in memory products, the company maintains stable profits and proven track records. According to Findley, there are three key product lines driving growth for Montage, the first being specialty DRAM buffers. Montage started to develop its DRAM module buffer technologies very early. Given the buffer chip's critical role between the processor and DRAM memory, Montage collaborates with major CPU giants such as Intel and AMD, leading silicon IP vendors, as well as the world's top three memory manufacturers -- Micron, Samsung and SK hynix.Currently, Montage attributes its strong growth to the rapidly increasing demand for DDR5 memory used in data centers. Shipments of its DDR5 Registering Clock Driver (RCD) chips have grown substantially. Its 4th-gen DDR5 RCD chips deliver data rates of up to 7200 MT/s, a 50% increase over the 1st-gen products. Alongside its RCD portfolio, the company also provides DDR5 Data Buffers (DB) and other essential DDR5 module supporting chips like SPD EEPROM with Hubs, Temperature Sensors, and Power Management ICs.Considering the high throughput and low latency data processing use cases, MRDIMM (Multiplexed Rank Dual In-Line Memory Modules) are particularly useful to handle larger datasets such as large-scale databases, virtualization, and real-time analytic operations. In January 2025, Montage has successfully sampled its Gen2 Multiplexed Rank Registering Clock Driver (MRCD) and Multiplexed Rank Data Buffer (MDB) chipset to global leading memory manufacturers in South Korea, Japan and North America. These series IC solutions ensure interoperability and system-level performance for customers seeking to leverage the DDR5 MRDIMM Gen2 standard in high-throughput data-intensive applications. Montage's MRCD and MDB chips are fundamental to MRDIMM operationCredit: Montage TechnologyCXL adoption in data centers has moved from crawling to toddlingThe second product focus for Montage is CXL memory. CXL memory expansion is particularly valuable in scenarios where high DRAM capacity is required with only one DIMM per channel, or when servers lack available DIMM slots. Montage delivers the CXL Memory eXpander Controller (MXC) chips supporting the CXL 1.0, 2.0 and 3.1 specifications. These MXC chips comply with JEDEC specifications for both DDR4 and DDR5 memory. The mass-produced MXC Gen1 chips support CXL 2.0 with DDR4-3200/DDR5-5600, while the MXC Gen2 chips support CXL 2.0 and are compatible with DDR5-6400 memory.The development of CXL controllers is closely tied to PCIe interface technology. Current CXL 1.0 and 2.0 specifications primarily align with PCIe 5.0, while future CXL 3.x specifications are expected to align with PCIe 6.x to support even higher-speed memory channels. As memory pooling becomes more ambitious and widely adopted, the industry anticipates a surge in CXL deployment and volume scaling starting in 2026.The MXC product line is designed for use in Add-in Cards (AICs), backplanes or EDSFF memory modules to enable significant scalability in both memory capacity and bandwidth. Montage's MXC controllers are currently deployed by the world's top 3 memory manufacturers in E3.S form factor CXL memory modules. In parallel, Montage has launched several new product development projects in collaboration with Taiwan OEM/ODM partners. One such project involves working with a Taiwanese memory module manufacturer to develop CXL expansion card solutions. Another involves co-designing CXL memory AICs with major Taiwanese motherboard and server manufacturers, targeting OEM/ODM opportunities with global cloud data center providers.Credit: Montage TechnologyAs the second largest PCIe 5.0 and PCIe 4.0 Retimer supplierThe third product line for Montage is its Retimer chips, originally designed to enhance connectivity performance between GPUs, AI accelerators, CPUs, and other components within server systems. Retimer chips regenerate high-speed digital signals to extend reach and improve signal integrity in high-speed data processing systems. Currently, a typical AI server – often equipped with 8 GPUs -- requires 8 or even 16 PCIe 5.0 Retimer chips.Montage started delivering its PCIe 5.0/CXL 2.0 Retimer chips in January 2023, putting massive effort to extensive interoperability testing with a variety of compute, storage and networking components, such as CPUs, PCIe switches, SSDs, GPUs and NICs. As a result, Montage is now the second-largest PCIe 5.0 and PCIe 4.0 Retimer supplier globally and is dominating the market in China.Montage's Retimer chips are integrated into a variety of systems, including AI accelerator baseboards, server motherboards and riser cards. Montage is now providing the customer samples of its 16-lane PCIe 6.x/CXL 3.x Retimer chips as part of its new product roadmap.Activities in COMPUTEX Taipei 2025Montage has a global team of over 700 employees. During the trade show season and COMPUTEX Taipei 2025, Montage and its Taiwan partners will showcase a series of silicon products in a hotel suite showroom at the Place Taipei Hotel in the Nangang district. Findley describes this initiative as a strategic marketing campaign focused on highlighting the company's latest products -- including Retimer chips -- and introducing Montage brand to attract new customers from Taiwan's electronics supply chain and server manufacturing sector. In addition, the company will host advanced product training sessions to capture new business opportunities.AI applications are rapidly increasing in computational demands, doubling every few months, and now represent the primary driver of the PCIe roadmap–making PCIe Gen 6 a key requirement for the next generation of data centers. Meanwhile, CXL technology is reshaping the industry with its innovative memory architecture. Montage looks forward to working with Taiwan-based electronics OEMs/ODMs, server manufacturers and ecosystem partners to unlock the transformative potential of CXL technology and drive future success.

As Computex 2025 draws global attention to Taipei, IEI Integration Corp., in collaboration with QNAP Systems, Inc., will host its annual technology showcase, IEI Insight Days, from May 21 to 23 at POPOP Taipei. Designed for industry professionals, this three-day event focuses on actionable solutions in Industrial AI, resilient network infrastructure, and smart healthcare applications—bringing together real-world use cases, expert insights, and emerging technologies that address the evolving needs of edge computing and system integration.Hosted alongside Computex, this exclusive event by IEI and QNAP invites industry professionals to explore edge innovations in a relaxed and focused environment at POPOP Taipei.A Dedicated Experience Beyond the Show FloorLocated just one MRT stop from the Computex exhibition hall, POPOP Taipei offers a refreshing alternative to traditional trade show venues. Combining historical charm with modern design, the event space provides an ideal setting for relaxed yet focused dialogue. Whether you're exploring partnership opportunities, seeking insights on deployment strategies, or simply taking a break from the busy show floor, IEI Insight Days offers a curated environment to connect, learn, and exchange ideas.Event Highlights🔹 Focus Areas: Edge AI / Network Integration / AI-powered Healthcare 🔹 Showcase Solutions:  • Redundancy-enabled and Recovery-Ready Edge Platform  • Enterprise-grade networking infrastructure  • AI healthcare computing with real-time image processing and voice command capabilities 🔹 Networking Space: Open demo zones and seating areas designed for spontaneous technical conversations and business engagementIEI Insight Days is more than a product showcase — it's a hub for collaboration and conversation. We warmly welcome Computex attendees, industry partners, and decision-makers to stop by and engage with us. Dive into the latest trends in edge computing, network infrastructure, and medical AI.

In an era of rapid technological advancement, standards form the backbone of secure, reliable, and fair practices across industries. Standards are essential for ensuring consistency, quality, and safety, particularly in domains where data protection and cybersecurity are critical. This article explores why standards are indispensable, the scope they cover, and how regulations enforce them effectively. The article specifically addresses standards, such as ISO/IEC27001, ISO26262, ISO/IEC 15408 Common Criteria, SESIP, EU Cyber Resilience Act (CRA) and the EU Radio Equipment Directive (RED).Why Are Standards Required?Standards provide a structured approach to managing complexity and ensuring quality. They serve as universal guidelines that align practices, enabling compatibility, safety, and trust. Their role in protecting and securing data is paramount, ensuring that sensitive information is not only safeguarded but also managed ethically and efficiently.Data is a valuable asset that requires stringent protection. Standards like ISO/IEC 27001 for information security and ISO 26262 for functional safety in automotive systems ensure robust measures to protect data, infrastructure, and human safety. These frameworks establish best practices for encryption, secure access controls, and ethical handling of information. By adhering to these standards, organizations demonstrate their commitment to security and build a resilient foundation for technological advancement.Moreover, standards are pivotal for fostering international collaboration and interoperability. For instance, the seamless exchange of data between global organizations relies on shared protocols and secure practices defined by standards. This harmonization reduces trade barriers, boosts innovation, and ensures that technological progress benefits a broader spectrum of society.Standards also play a crucial role in shaping consumer trust. When products meet established safety and quality benchmarks, consumers gain confidence in their reliability. This is particularly significant in industries such as healthcare and finance, where trust in systems and devices is essential. For example, medical devices that comply with ISO 13485 demonstrate adherence to stringent safety requirements, ensuring their efficacy and reliability.What Do Standards Cover?Common Criteria, SESIP Standards address diverse industry and societal needs, ensuring compatibility, safety, and operational excellence across various domains. In cybersecurity and data protection, standards like ISO/IEC 15408 and SESIP provide frameworks for assessing IT security features and IoT device resilience. Similarly, ISO 26262 ensures functional safety in automotive systems, reducing risks associated with advanced electronic technologies.Cloud Security Emerging technologies also benefit from standards, which provide ethical and operational benchmarks for developments like AI, blockchain, and quantum computing. By embedding robust security measures, these standards mitigate risks, foster trust, and encourage technological advancement. For instance, ISO/IEC 27017 focuses on cloud security, while the EU RED directive sets clear guidelines for wireless communications, ensuring safer and more reliable technologies.Sustainability Another area where standards prove indispensable is environmental sustainability. Standards like ISO 14001 guide organizations in reducing their environmental impact, ensuring that businesses operate responsibly while minimizing their carbon footprint. This dual focus on innovation and sustainability underscores the multifaceted role standards play in modern society.Safety Moreover, standards influence consumer safety in industries such as healthcare. Devices adhering to ISO 13485 demonstrate stringent safety requirements, ensuring efficacy and reliability. Similarly, in aviation, ISO 45001 supports occupational health and safety management systems, creating safer working environments for crew and staff. These diverse applications illustrate the universal relevance of standards in promoting trust and safeguarding well-being.How Are Standards Enforced?While standards establish the framework, enforcement ensures their practical application and impact. Legislative tools remain the most powerful enforcement mechanism. Regulations such as the EU Cyber Resilience Act (CRA) and the EU Radio Equipment Directive (RED) mandate compliance with stringent cybersecurity and safety benchmarks, especially for products with digital and wireless communication elements. These regulations demand adherence to established standards, ensuring robustness against evolving threats.Certifications Certification requirements further validate compliance. Standards like ISO/IEC 15408 (Common Criteria) and SESIP for IoT devices involve rigorous third-party evaluations to confirm adherence. Regular audits and inspections maintain ongoing compliance, fostering trust among stakeholders. For example, SESIP evaluations assess the security posture of IoT devices across various implementation contexts, ensuring they meet predefined security baselines.Penalties Penalties for non-compliance, such as fines and operational restrictions, act as significant deterrents. Collaboration between public authorities and industry stakeholders ensures enforcement mechanisms remain practical and adaptive. Advanced technological tools, including AI-driven compliance monitoring systems, streamline enforcement, making adherence more efficient.Self-Assessment Additionally, industry self-regulation plays a vital role in the enforcement of standards. Many organizations adopt voluntary compliance measures, recognizing that adhering to high standards not only ensures safety and quality but also enhances their competitive edge. Collaborative industry initiatives, such as the GlobalPlatform SESIP certification program, exemplify how collective efforts drive the enforcement of standards across sectors.Challenges and Future DirectionsBalancing compliance with innovation is a significant challenge. Overregulation can hinder creativity, while under regulation exposes vulnerabilities. Adaptive standards that evolve with technological progress are essential. For instance, ensuring that frameworks like ISO 21434 for automotive cybersecurity remain relevant to advancing vehicle technology is critical. Additionally, global harmonization of standards facilitates international trade and collaboration.Enhancing enforcement mechanisms, including leveraging advanced tools and public engagement, ensures comprehensive compliance. Continuous improvement through regular updates keeps standards relevant, addressing emerging challenges effectively. For example, campaigns aimed at educating citizens about data security not only empower individuals but also foster a collective commitment to maintaining high standards across industries.Another future direction is the integration of standards into emerging digital ecosystems, such as smart cities and autonomous vehicles. These environments require robust, interoperable standards to manage the complexity of interconnected systems while ensuring safety and security. The development of new standards for AI ethics, IoT security, and blockchain interoperability is a testament to the ongoing evolution of standardization efforts.ConclusionStandards are the cornerstone of a secure, reliable, and innovative global landscape. Enforced through powerful legislative tools, such as the EU CRA and RED, and complemented by public awareness, they protect data, ensure safety, and foster trust. Examples like ISO/IEC 27001 and ISO 26262 highlight their critical role across sectors. By integrating emerging technologies with adaptive standards, the future promises a harmonious blend of innovation and security. Continuous public education and engagement will further bolster these efforts, ensuring a sustainable and secure technological ecosystem for generations to come.As technology advances, the role of standards will only grow in importance. From protecting sensitive data to fostering international collaboration, standards provide the foundation for progress. By embracing adaptive standardization and robust enforcement mechanisms, society can navigate the challenges of the digital age with confidence and resilience.In an era where system vendors must navigate diverse cybersecurity regulations across different regions, Winbond alleviates these challenges by providing pre-certified products that streamline compliance efforts. Winbond Secure Flash products are pre-certified with various cybersecurity standards, easing the certification process for customer platforms. Additionally, Winbond offers a complete turnkey solution, including pre-certified devices, software, and conformance documentation tailored to regulatory requirements such as the EU Cyber Resilience Act (CRA) and the EU Radio Equipment Directive (RED).For more information on how Winbond can support your security and compliance needs, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

Phoenix Technologies, a leading independent firmware provider for PCs and embedded systems, today announced a partnership with Coretronic Reality Inc. (CRI), a subsidiary of Coretronic Corporation and a provider of advanced embedded solutions. As part of this collaboration, Phoenix Technologies has supplied UEFI firmware for CRI's new R6490WGQ System-on-Module (SOM), powered by the Qualcomm Dragonwing™ QCS6490 processor.CRI unveiled the R6490WGQ at Embedded World 2024 in Nuremberg, Germany, positioning it as a next-generation platform for AI and industrial applications. With its high-performance 6nm octa-core architecture, built-in AI engine, and support for 5G and Wi-Fi 6E connectivity, the R6490WGQ SOM is designed to accelerate development across AI for IoT products, Point of Sale (POS), machine vision, industrial PCs and more.Phoenix Technologies' UEFI BIOS was selected for its reliability, security, fast boot performance, and customizable feature set tailored to the needs of embedded developers. By integrating Phoenix firmware into the R6490WGQ, CRI can offer customers a robust and production-ready platform with full UEFI support out of the box."This collaboration demonstrates Phoenix's commitment to enabling innovation across the embedded ecosystem," said Jim Mortensen, Senior VP of Engineering, Phoenix Technologies. "Our UEFI firmware allows CRI to deliver a consistent, secure, and highly customizable experience that meets the demands of modern embedded devices"."We were impressed with the maturity, feature set, and flexibility of Phoenix's UEFI BIOS," said Nore Chen, General Manager, Coretronic Reality Inc. "Phoenix's UEFI BIOS integrated seamlessly with our R6490WGQ SOM platform, enabling fast boot, enhanced security, and long-term stability right out of the box. This allows us to deliver the level of performance, reliability, and customization our industrial and AIoT customers demand. We're excited to continue deepening our collaboration with Phoenix as we scale our solution portfolio across next-generation embedded applications."CRI's R6490WGQ SOM, featuring Phoenix UEFI BIOS, is now available to OEMs and developers worldwide.

The global wave of Artificial Intelligence (AI) is reshaping industrial paradigms across sectors. The convergence of wireless communication and AI is propelling AIoT into a new era, where diverse intelligent applications demand optimal performance, power efficiency, and cost-effectiveness to achieve scalable deployment. As a global leading provider of wireless communication modules and AI solutions, Fibocom is redefining its core competencies through an AI-centric platform approach, driving the deep integration of AI and connectivity to unlock new opportunities for intelligent transformation across industries."Traditionally, the core value of communication modules was 'connectivity,' but today, we're seeing AI capabilities rapidly extending to the edge," said Tiger Ying, CEO of Fibocom. "Modules are evolving into intelligent hubs capable of computation, sensing, and decision-making. The edge-cloud collaboration exemplifies the value of AI-communication convergence, and the role of the module is being redefined."Seamless Integration of Hardware and Software: Fibocom's Full-Stack Solutions Empowering the AIoT EraWith deep expertise in wireless communication, AI technologies, and integrated software hardware abilities, Fibocom is actively deploying AI at edge computing nodes to enable intelligent terminals. Through its "AI for X" initiative, the company delivers all-around AI capabilities, products, industry solutions, and ecosystem collaborations to accelerate the industry's transformation from "connect everything" to "intelligently connectivity."Fibocom's AI offerings are tailored for a wide range of vertical scenarios, including smart robotics, autonomous driving, industrial control, and smart retail. For lightweight AI applications, the company has introduced large-model solutions supporting voice and vision interaction, ideal for upgrading devices like AI toys and smart speakers. On the edge AI front, solutions such as the Nebula Series and 5G FWA SkyEngine Solution enable the deployment of large models directly on devices, significantly reducing latency and power consumption while enhancing real-time responsiveness and user experience.Fibocom's one-stop solutions encompass AIoT modules, AI models, AI agents, global connectivity, and cloud services, driving digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy. Built on the foundation of seamless software-hardware integration and full-stack coordination, these solutions reinforce Fibocom's position as a leading AIoT platform enabler.AI + Vertical Applications: Accelerating Commercialization and Validation of Smart TerminalsIn recent years, Fibocom has made remarkable progress in the field of smart robotics. Its self-developed embodied intelligent development platform whose name is Fibot integrates AI algorithms, IoT connectivity, and automated control, enabling leading global robotics brands to elevate their product intelligence and performance.A remarkable milestone is the launch of the world's first "vision-only" intelligent lawn mower solution in 2025. Unlike traditional lawn mower solutions, this breakthrough solution requires no physical boundary setup or base station support. Instead, it relies entirely on machine vision and AI algorithms for precise navigation and obstacle avoidance—delivering a true "perception-to-action" experience. "This is more than a technical innovation—it's a glimpse into the future of smart devices," noted Tiger Ying. The solution has already been rolled out across several European markets and earned a 5-star rating from Germany's leading tech media outlet Heimwerker, underscoring Fibocom's global competitiveness in AI innovation.Beyond robotics, Fibocom is redefining the value of 5G FWA through its SkyEngine solution, which combines AI computing with advanced connectivity. Designed to support local AI inference, concurrent multi-tasking, and cross-device collaboration, the platform serves as a powerful "super-intelligent agent" at the edge—enabling applications in smart homes, remote work, and multimedia processing. It also empowers telecom operators to evolve from bandwidth providers into intelligent service enablers.Driven by a dual-engine strategy of "algorithms + computing power," Fibocom is accelerating the commercialization of vertical AI applications—solidifying its transformation from a wireless communication module supplier to a global leader in AI-driven solutions.Addressing AI Integration Challenges with Systematic InnovationAs edge AI adoption accelerates, Fibocom is proactively addressing the associated challenges through a comprehensive and forward-looking approach. In the realm of data security and privacy, the company adheres to a "data minimization" principle from the design stage—enhancing on-device processing to reduce data exposure risks and strengthen user trust.For power-sensitive applications, Fibocom delivers high-performance, energy-efficient AI hardware solutions, optimizing resources from semiconductor architecture to algorithmic efficiency. Meanwhile, to address the complexities of computing scalability and ecosystem integration, Fibocom is building an open, flexible collaboration platform that enables customers and partners to co-create value, share in the AI-driven ecosystem, and accelerate real-world deployment across diverse use cases."We are committed to long-term value creation and scalable commercialization, with a sharp focus on edge AI solutions," said Tiger Ying. "Modules are not only the nearest data entry point to end devices—they are also the critical gateway to unlocking the full potential of AI."At the forefront of the AI revolution, Fibocom continues to be a foundational force in enabling intelligent connectivity, propelling the AIoT industry into a new era of transformation.

The "AI Wave: Taiwan Generative AI Applications Hackathon," organized by DIGITIMES in collaboration with Taiwan's National Development Council, successfully concluded its second annual event in Taipei from April 26 to 27, 2025. Amazon Web Services (AWS) served as the AI technology provider for this competition, attracting 100 teams from across Taiwan comprising approximately 400 students, developers, and professionals who gathered to demonstrate the innovative potential of generative AI across various industries.This year's event invited eight leading companies to design scenario-based challenges according to their industry needs: Cooler Master's "PC DIY Innovation," Chunghwa Telecom's "Resilient Future," Taishin Financial Holding's "Financial Innovation," Eastern Home Shopping & Leisure's "Next-Gen Retail," Chang Chun Group's "Smart Petrochemical Manufacturing," Advantech's "Intelligent Edge-Cloud Control," Walsin Lihwa's "Smart Manufacturing," and Gamania Group Vyin AI's "AI Idol." The organizers hoped that through industry challenges, technological support, and creative collaboration from various sectors, generative AI technology would continue to deepen its applications across diverse fields, driving Taiwan's industrial digital transformation toward new frontiers.As global political and economic environments rapidly change, businesses increasingly demand AI industry innovation talent with practical AI experience, international vision, and bilingual capabilities to reduce costs and enhance competitiveness. The "AI Wave: Taiwan Generative AI Applications Hackathon," held for two consecutive years, serves as an important platform for promoting cross-domain collaboration and helping enterprises connect with external AI talent, thereby enabling businesses to establish competitive advantages in the international AI ecosystem through collaboration with innovative talents. This competition provides an opportunity for innovators and developers to showcase their talents, particularly for participants who can spark more creative ideas through on-site exchanges.Colley Hwang, Chairman of DIGITIMES, noted that generative AI has become a crucial force driving industrial applications and everyday life transformations,allowing businesses to reduce costs, enhance experiences, and boost revenue growth—essential drivers for industrial transformation. As a global technology industry hub, Taiwan could further develop a complete digital AI ecosystem from chips to comprehensive solutions if it successfully integrates AI talent with its excellent foundation as a Silicon Island. "We continue to host the 'Taiwan Generative AI Applications Hackathon' to cultivate creativity and promote cross-domain collaboration, helping young talents understand industry needs and serving as an important driver for continued industrial growth," said Hwang.Robert Wang, Managing Director of AWS Taiwan and Hong Kong, pointed out that in today's digital economy, generative AI technology will become increasingly important, shaping the future and bringing more innovative possibilities with significant contributions to Taiwan's economic development. Wang further elaborated on the growth of the hackathon. Compared to last year, this year's "AI Wave: Taiwan Generative AI Applications Hackathon" saw a substantial increase in registrations, indicating that many innovators have begun applying technologies such as Amazon Nova multimodal models and Agentic AI to their development projects. "With 'Customer Obsession' as our core value, we leverage AWS's experience supporting Amazon's innovations across logistics, semiconductors, AI, robotics, drones, and low-orbit satellites to help Taiwan's industrial customers accelerate their innovation in key technological processes," said Wang. "80% of global unicorn startups are on AWS. We will continue to fully support developers in transforming creativity into minimum viable products and accelerating the implementation and market landing of innovative ideas, and we look forward to collaborating with more local Taiwan startups to co-create a brilliant digital future."400 AWS Developers Compete in Intense 30-Hour Battle with 8 Teams Winning Jury RecognitionThe "2025 AI Wave: Taiwan Generative AI Applications Hackathon" was divided into "Hacker" and "Idea Exchange" categories. Competing teams were required to use AWS cloud and generative AI services—such as Amazon Bedrock, a fully managed service that makes high-performing foundation models, Amazon Q Developer for generative AI software development assistance, and PartyRock for no-code generative AI application builder—to create applications meeting enterprise needs and then demonstrate their results to the judges. For both categories, company representatives served as mentors alongside AWS solutions architects, helping participants utilize AWS's various AI tools and cloud services combined with enterprise data for concept ideation and implementation. The evaluation criteria for both categories covered creativity, technical feasibility, business applicability, theme relevance, and completion level to ensure participants could fully demonstrate their technical prowess and creative potential.In the "2025 AI Wave: Taiwan Generative AI Applications Hackathon," all 100 participating teams demonstrated abundant innovative thinking and strong technical capabilities after receiving professional training through enterprise data workshops and AWS generative AI workshops. Many teams noted that before participating, they were unfamiliar with generative AI technologies but successfully leveraged AI tools and data resources thanks to technical guidance from AWS experts and industry knowledge sharing from corporate mentors, ultimately transforming their creative ideas into viable solutions during the competition.After a grueling 30-hour competition, this year's "Hacker" category produced seven winning teams. The "Cloud Ninjas" team from Chang Chun Group's "Smart Petrochemical Manufacturing" challenge secured victory by successfully transforming personnel expertise into voice-driven intelligent decision-making processes, creating a more natural and fluid human-machine collaboration experience. The "Otter Knocking Boat" team from Taishin Financial Holding's "Financial Innovation" challenge utilized banking transaction records and basic account information to propose an AI-driven financial fraud detection system. The "Alpha Three" team from Walsin Lihwa's "Smart Manufacturing" challenge presented precise data preprocessing and system architecture optimization strategies for international stainless steel industry standards, successfully improving knowledge base retrieval and response quality. The "Famous on the Board" team from Cooler Master's "PC DIY Innovation" challenge approached from user pain points, combining natural language analysis and image generation technology to propose an AI PC case design platform solution assisting designers.The "Cloud Science Network Management" team from Eastern Home Shopping & Leisure's "Next-Gen Retail" challenge formulated personalized sales strategies based on customer data analysis needs and built an AI voice sales system achieving automated customer service and precise sales. The "AWS Hero Song" team from Advantech's "Intelligent Edge-Cloud Control" challenge utilized industrial AI camera - ICAM combined with generative AI services to create an innovative medical communication system, effectively improving patient safety in healthcare scenarios. The "Disheveled in the Wind" team from Gamania Group Vyin AI's "AI Idol" challenge combined intelligent interaction, voice dialogue, and emotional memory functions to create a smart idol product that truly accompanies fans.The winning team in the "Idea Exchange" category was the "Revenge Seekers" from Chunghwa Telecom's "Resilient Future" challenge, who built an intelligent system helping people without medical backgrounds perform initial emergency aid procedures, using AI to improve disaster response efficiency.The jury stated that each participating team demonstrated excellent capabilities and rich imagination, impressive in both technical depth and creative breadth. They expressed deep admiration for the participants' dedication and effort, hoping this experience would serve as nourishment for continued improvement and enable participants to create greater impact in their professional fields. Additionally, the organizers specially added an "Inclusive AI Award," with winning teams "Global Ambition Team" and "Zhong Liang Ju," hoping to attract more teams to participate in next year's competition.This competition is expected to establish a solid foundation for Taiwan's generative AI field development, leading to a prominent position in global AI competition.

In an era demanding ever-smaller, more efficient, and higher-performing light sources, particularly in the short-wave infrared (SWIR) spectrum crucial for telecom and advanced sensing, a quiet revolution is underway in integrated photonics. CoreOptics is at the forefront, pioneering a new generation of surface-emitting lasers at 1310nm that promise to overcome the limitations of traditional edge-emitting counterparts.For years, integrating lasers onto photonic integrated circuits (PICs) has been a complex dance of alignment and interconnection. Now, CoreOptics is changing the steps with its innovative SWIR high-power Continuous Wave (CW) surface-emitting laser. The secret? Its inherent surface emission capability, tailor-made for direct flip-chip integration. This seemingly simple shift unlocks a cascade of benefits, streamlining manufacturing and paving the way for unprecedented integration efficiency.Beyond the Edge: The Power of Surface EmissionThe limitations of conventional edge-emitting lasers in integrated systems are becoming increasingly apparent. CoreOptics is embracing a different paradigm: Horizontal Cavity Surface Emitting Lasers (HCSELs). Imagine an edge-emitting laser cleverly engineered with a turning mirror, redirecting its light output perpendicular to the semiconductor wafer's surface. This ingenious design allows for packaging reminiscent of familiar Vertical Cavity Surface Emitting Lasers (VCSELs) or LEDs, but with distinct advantages.HCSELs offer a compelling alternative, most notably enabling wafer-scale testing. This fundamental shift in manufacturing allows for rigorous quality control at an early stage, translating to lower production costs and significantly higher throughput.But the benefits don't stop there. Surface emission inherently delivers:• Superior Grating Coupling: Resulting in significantly better grating coupling efficiency into the PIC.• Ultra-Compact Footprint: A crucial factor in the relentless drive towards miniaturization of integrated systems, allowing for denser and more powerful PICs.• Untapped Potential: Opening doors to the creation of higher power and more complex integrated light sources, pushing the boundaries of what's possible on a chip.CoreOptics' Innovation: SWIR PowerhouseAt the heart of CoreOptics' advancement lies its novel 1310nm (FP/DFB)high-power CW surface-emitting laser design. Leveraging advanced InP-based alloys and a meticulously optimized layered epitaxial structure, this laser is engineered for peak performance in the SWIR region.Key to its integration prowess are its innovative design features, including:• AR/HR Wafer-Level Coating: Enhancing optical performance and simplifying the manufacturing process.• Etched Facet (Mirror) and 45-Degree Reflector: Precisely engineered for efficient light extraction and surface emission. These features streamline production and contribute directly to the laser's superior performance and seamless integration capabilities.Flip the Chip, Transform the IntegrationThe true magic unfolds with direct flip-chip integration onto PICs. This technique involves attaching the laser die directly onto the PIC substrate, "face down." It's a seemingly small change with profound implications.By embracing flip-chip bonding, CoreOptics is effectively bypassing the complexities of traditional wire bonding and intricate packaging steps, leading to a new era of integration efficiency characterized by:• Lightning-Fast Electrical Paths: Shorter pathways translate directly to higher speed operation and pristine signal integrity – critical for high-bandwidth applications.• Unprecedented Compactness: The elimination of bulky interconnects results in a significantly smaller overall footprint for the integrated laser-PIC module, paving the way for truly miniaturized devices.• Pinpoint Optical Alignment: The direct and meticulously controlled bonding process ensures precise and stable optical grating coupling between the laser and the PIC waveguide, maximizing efficiency and reliability.SWIR HCSELs: SWIR Horizontal Cavity Surface Emitting Lasers Credit: CoreOpticsSimplifying the package: Less is moreThe elegance of flip-chip integration extends to packaging. By directly bonding the laser, CoreOptics is drastically reducing the need for intermediate components and connections for both electrical and optical interfacing. This simplification translates to:• Fewer Interconnects, Higher Reliability: Eliminating potential points of failure leads to more robust and dependable integrated devices.• Streamlined Assembly: The direct bonding process simplifies the manufacturing flow, potentially lowering assembly costs and boosting overall reliability.• Smaller and Lighter Packages: A crucial advantage for applications where size and weight are at a premium, such as portable sensing devices and wearable technology.A Spectrum of Possibilities: Applications UnleashedThe unique advantages of CoreOptics' integrated SWIR HCSEL laser solution are poised to revolutionize a wide array of applications, including:• High-Speed Optical Communication: Enabling next-generation on-chip interconnects and ultra-compact silicon photonics transceivers.• Advanced Sensing: Powering integrated LiDAR systems for autonomous vehicles and robotics, as well as compact gas sensing platforms.• The Smart Revolution: Enabling under-display proximity sensing in smartphones and other consumer electronics.• Miniature Analytical Instruments: Facilitating the development of compact spectroscopy devices for on-the-go analysis.• Next-Gen Medical Diagnostics: Enabling the creation of sophisticated lab-on-a-chip devices for SWIR imaging and advanced biosensing.Expanding the Horizon: 1460nm and BeyondCoreOptics isn't stopping at 1310nm. Their development of surface-emitting SWIR lasers at 1460nm further expands their reach. This wavelength offers its own set of compelling advantages, including low water absorption for long-distance fiber optic communication and high modulation capability for advanced data transmission and sensing. Potential applications span telecommunications, cutting-edge medical sensing and imaging (think non-invasive skin and glucose sensors), and precision industrial and environmental monitoring.Illuminating New Paths: Resolight RCLEDsComplementing their laser portfolio, CoreOptics also offers Resolight Resonant-Cavity Light-Emitting Diodes (RCLEDs) across a broad spectrum from 400nm to 1550nm. These aren't your average LEDs. Their resonant cavity structure dramatically enhances optical confinement, resulting in:• Highly Directional Emission: Focusing light along a specific axis, unlike the omnidirectional output of standard LEDs.• Small Divergence Angle: Enabling excellent beam collimation, minimizing light spread.• Exceptional Color Purity: The resonant cavity acts as a filter, suppressing unwanted spectral leakage for a purer monochromatic output.• Narrow Spectral Width: Achieving Full-Width at Half Maximum (FWHM) values between 10-20nm, significantly narrower than conventional LEDs.• Robust Operation: Withstanding a wide temperature range of -40 to 85 degrees Celsius.These enhanced characteristics make Resolight RCLEDs ideal for applications ranging from short-reach optical communication and high-resolution displays to the burgeoning field of visible light communication (VLC), precise optical sensing and scanning, and advanced medical and cosmetic devices.Tailored Solutions: Design Flexibility at its CoreRecognizing the diverse needs of their clientele, CoreOptics leverages its unique HCSEL platform to offer customized solutions. By precisely engineering the reflector angle based on the specific grating angles of the PIC, they can optimize performance for individual customer requirements.CoreOptics' the feature product lines, encompassing a wide range of Horizontal Cavity Surface Emitting Lasers (HCSELs) and high-performance Resonant Cavity LEDs (ResoLight), position them as a key innovator in the rapidly evolving landscape of integrated photonics.As the demand for compact, efficient, and high-performance light sources continues to surge, CoreOptics' pioneering work in surface-emitting lasers and their seamless integration onto PICs is poised to revolutionize industries and unlock a new era of photonic innovation.

MSI, a global leader in gaming and high-performance computing, announces the launch of its comprehensive AIoT solution lineup at COMPUTEX 2025, featuring AI servers, AI supercomputers, smart energy, industrial PCs, and intelligent transportation systems. The showcase extends beyond core AI computing to system integration, hardware innovation, and cross-domain applications—demonstrating MSI's leadership as a provider of AI-driven and high-performance technologies for next-generation industries."AI is no longer just a trend—it is a critical engine driving industrial intelligence," said Sam Chern, MSI Vice President of Marketing."With deep hardware R&D capabilities and a strong focus on high-performance and AI-integrated systems, MSI is expanding its reach from data centers to the edge, from energy management to smart manufacturing. Through this showcase, we hope to present our vision for a smarter, cross-domain technology future.Product Highlights�UAI Servers × Cloud InfrastructureFull-Rack IntegrationMSI presents turnkey rack-level infrastructure, including 19" EIA, 21" OCP ORv3, and NVIDIA MGX AI racks.• The EIA rack targets dense compute environments such as private clouds and virtualization.• The OCP ORv3 rack features an open 21" chassis with 48V power delivery and OpenBMC support for hyperscale data centers.• The AI rack, aligned with NVIDIA's reference architecture, supports MGX modular systems and NVIDIA Spectrum™-X networking, enabling multi-node GPU scaling for AI training and inference. All racks are deployment-ready and thermally optimized.Core and Open Compute ServersMSI expands its DC-MHS modular server lineup with AMD-based CD270-S4051-X4/X2, CD281-S4051-X2 (compliance with the ORv3 standard) and Intel-based CD270-S3061-X4/X2, CD270-S3071-X2. All systems feature 2U4N or 2U2N form factors, PCIe Gen5, DDR5, and support up to 12 NVMe drives and 16 DIMM slots per node—designed for modular, high-density, and I/O-optimized cloud workloads.Credit: MSIAI Platforms & DGX StationMSI introduces MGX GPU servers for AI workloads:• CG480-S5063 (Intel) and CG480-S6053 (AMD) support 8 FHFL dual-width PCIe 5.0 GPUs, 32 DDR5 DIMMs, and up to 20 E1.S NVMe bays (Intel).• The CG290-S3063 (2U) supports 4 FHFL dual-width GPU and 16 DDR5 DIMMs slots in a compact design, ideal for edge inferencing and lightweight AI training.• The CT60-S8060 DGX Station, based on NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, delivers up to 20 PFLOPS of AI performance, 784GB of unified memory, and up to 800Gb/s networking—tailored for on-prem training, distributed inference, and collaborative R&D.Enterprise PlatformsMSI delivers complete solutions across DC-MHS and standard architectures:• DC-MHS platforms include CX270, CX171, CX271 series servers and HPMs such as D3066, D4056.• General-purpose systems include the S2206 (dual-socket AMD EPYC) and CS280-S3065 (Intel Xeon 6, 2U 24-bay storage).• Standard motherboards span ATX and uATX form factors, supporting Intel Xeon 6 and AMD EPYC 9005/8004/4005 processors—designed for scalable cloud, virtualization, and storage deployments.Credit: MSIIndustrial PCs × Rugged TabletsMSI debuts the EdgeXpert MS-C931, a desktop AI supercomputer built on the NVIDIA DGXTM Spark platform.Powered by the NVIDIA GB10 Grace Blackwell Superchip, it delivers 1000 AI TOPS FP4, 128GB unified memory, and ConnectX-7 networking—ideal for developers in education, finance, and healthcare sectors.Also introduced are three software tools:• MSI SysLink: Remote device management• MSI ScreenLink: EDID Lock for digital signage• MSI AI SmartLink: Seamless integration with large language modelsThese tools complement MSI's full line of Box PCs and embedded boards, designed for next-generation AI and industrial automation.MSI debuts two new rugged tablet models—the NB41 and NE21—designed to meet the demanding requirements of field workers and industrial environments.• NB41 features an 8-inch display and is equipped with an Intel Alder Lake-N processor. It is MIL-STD 810G validated, drop-tested to 1.5 meters, and rated IP65 for dust and water resistance. It supports Wi-Fi 6E, Bluetooth 5.3, and offers a 7-hour battery life with hot-swappable capability, ensuring continuous operation in mission-critical scenarios.• NE21 is an 11.6-inch model powered by a 13th Gen Intel Raptor Lake Core i processor. It features an 800-nit sunlight-readable LCD, IP65 water/dust protection, MIL-STD 810G test criteria, and 4G LTE support. With a 7.5-hour battery, it is ideal for field deployments requiring extended mobile connectivity.Both tablets support a range of accessories, including shoulder straps, hand grips, styluses, and tablet stands—providing ergonomic flexibility and operational durability for warehouse, logistics, manufacturing, and utility applications.EV Charging × Smart EnergyMSI EZgo Portable EV ChargerMSI EZgo supports up to 11kW output and features a lightweight and portable design, and IP66 waterproof/dustproof housing, which is ideal for convenient charging during travel and at home. Replaceable adapters support international standards (US/EU/TW/JP/KR/AU/Industrial), and it is UL2263 and UL817 certified. Built-in 1.8" display and Bluetooth app enhance user control. It withstands up to 2-ton enclosure weight and 20-ton cable crush force, and includes warranty and insurance support.MSI Hyper 80 DualDesigned for commercial locations with 1–2 hour parking durations, such as shopping malls, restaurants, and cinemas, the ultra-slim 80kW dual-gun DC fast charger measures just 30cm thick. With ISO 15118 and DIN 70121 support, Plug & Charge, and dynamic power distribution, it is optimized for urban and commercial charging environments. Its overhead cable management system reduces wear and extends service life.MSI EV/Eco Series & eConnect System (EMS)These residential/commercial units feature solar-ready integration, 13kW (single-phase) or 22kW (three-phase) output, and AI license plate recognition. The eConnect system (EMS) offers real-time visibility, remote control, dynamic load balancing, and multi-user billing via a user-friendly interface—recipient of the iF Design Award.Autonomous Mobile Robots (AMRs) × Smart ManufacturingMSI will highlight its latest AI-powered Autonomous Mobile Robots (AMRs) built for smart manufacturing and warehouse automation. Built on NVIDIA Jetson Orin Nano system-on-modules, NVIDIA Isaac robotics platform, and NVIDIA Omniverse, MSI AMRs enable real-time navigation, intelligent fleet coordination, and digital twin simulation.MSI will showcase two flagship AMR models, each tailored for different smart factory needs:• AMR-AI-Cobot Pro: Robotic arm with AI vision for precise material handling and assembly• AMR-AI-Base Robot: Intelligent delivery and sorting solution for automated warehouse operationsBoth models integrate advanced features such as LiDAR-based SLAM, AI-driven motion planning, and energy-efficient battery management—helping factories improve efficiency, reduce costs, and scale operations.MSI unveils its latest AMRs powered by NVIDIA Jetson Orin Nano, Isaac robotics platform, and NVIDIA Omniverse.Smart Transportation – Fleet Management SolutionsMSI is expanding into smart transportation with a diverse range of fleet management products. The product line includes fleet management tablets, telematic boxes with license plate and object recognition function, and smart rearview mirrors. Powered by edge computing and AI-driven image analysis, MSI helps logistics and commercial fleets enhance operational efficiency and safety on the road.Smart Office – AI Video Conference SystemMSI's new Smart Office solution features an all-in-one AI-powered video conference bar with 4K video, auto-tracking, voice enhancement, ANC, and AGC for clear communication. Paired with a 360-degree conference camera and control panel, it enables seamless collaboration across meeting room setups and remote teams.Exhibition InfoLocation: Booth J0506, Hall 1, Taipei Nangang Exhibition Center📅 Dates: May 20–23, 2025MSI AIoT: https://www.msi.com/to/aiotMSI AIoT Facebook: https://www.facebook.com/MSIAIoTMSI AIoT LinkedIn: https://www.linkedin.com/showcase/msi-aiotMSI Global YouTube: https://www.youtube.com/user/MSISubscribe to MSI RSS Feeds via https://www.msi.com/rss for real-time news and more product info.About MSI AIoTMSI integrated server in conformity to the cloud idea, satisfy the needs of customers in industrial computers, introduced robots for AI living and realized automotive electronics with human technology to provide the optimum solution of AIoT. It is also a leading brand in AI, business, and IoT market. For more product information, please go to https://www.msi.com/to/aiot

Pegatron Corporation, a global leader in design and manufacturing services (DMS), today announces its inaugural appearance at Computex 2025. The event will be held from May 20 to 23 at the Taipei Nangang Exhibition Center. Presenting its vision as a "TECH MAKER," Pegatron will demonstrate its unwavering commitment to technological research and development (R&D) and leading innovation.At this year's exhibition, Pegatron will feature four major thematic zones under the "TECH" banner, comprehensively showcasing the company's latest achievements and solutions in high-performance AI computing, E-mobility, next-generation communication, beauty technology, and living assistance. These displays will further underscore Pegatron's vision and strength as a "TECH MAKER."High-performance AI computingPegatron is proud to unveil its next-generation, ultra-high-density rack solutions, meticulously engineered to support the most demanding AI, HPC, and data center workloads. Featuring a flexible architecture, these platforms now feature support for the latest NVIDIA GB300 NVL72, NVIDIA HGX™ B300, and AMD Instinct™ Series GPUs, delivering exceptional compute density and scalability. This architecture empowers enterprises to accelerate AI model training and inference while maintaining optimal performance across diverse and evolving workloads.Expanding compute flexibility, Pegatron introduces the AI GPU server AS205-2T1 and general-purpose server GS202-2T1, featuring Intel® Xeon® 6 processors and support with SMART Modular Technologies add-in cards (AIC) for CXL (Compute Express Link) memory expansion to enable enhanced bandwidth and dynamic memory pooling.To effectively manage the heat generated by these high-performance components, Pegatron offers a range of advanced liquid cooling solutions. These include in-rack Coolant Distribution Units (CDUs), Rear Door Heat Exchangers (RDHx), and full immersion tank cooling—each designed to optimize thermal efficiency, reduce energy consumption, and enable sustained performance in high-density environments.Pegatron's layout in the AI field extends beyond hardware, encompassing its self-developed digital twin platform, PEGAVERSE, and AI platform, PEGAAi. Through these two platforms, enterprises can enhance their autonomous operation capabilities and respond more agilely to industry changes. PEGAVERSE assists companies in building digital twin models to simulate and predict real-world behaviors, while PEGAAi provides powerful AI capabilities to help businesses make more informed decisions.By integrating innovative technologies, enterprises can achieve more efficient operations and better decision-making. The combination of digital twins and artificial intelligence helps companies maintain a competitive edge, especially in rapidly changing business environments. Pegatron enables businesses to establish a more agile and efficient operational system, thereby maintaining a leading position in the ever-changing world.E-mobility & Car computingPegatron Automotive Electronics anchors its strategy in the development and integration of advanced automotive electronics, delivering extensive end-to-end solutions to its automotive customers through robust manufacturing capabilities and agile supply chain management.Amid the rapid industry shift toward intelligent, electrified, and software-defined vehicles, Pegatron is re-architecting its Electrical/Electronic Architecture (EEA) to establish a platform that is highly integrated, modular, and scalable. The company's latest vehicle EEA solutions—including zonal controllers and a scalable central computing rack (SCCR)—reinforce its engineering leadership and readiness for next-generation automotive innovation.Telecommunication & network solutionsPegatron's Communication Products Business Group is set to showcase a comprehensive portfolio of networking solutions, engineered to bolster enterprise digital resilience. A key highlight will be the "Exhibition Hall Rapid Deployment Business Model," an innovative 5G private network solution that integrates O-RAN architecture with Fixed Wireless Access (FWA) devices. This system facilitates high-speed, flexible deployment and real-time live streaming, concurrently supporting crowd analytics and content broadcasting to optimize exhibition effectiveness.Further demonstrating its leadership in connectivity, Pegatron will present the BE19000 tri-band Wi-Fi 7 router. This advanced router supports Multi-Link Operation (MLO) technology, delivering total data rates of up to 19Gbps, and is adeptly designed for 8K streaming and robust multiple device connections. In addition, an AI-integrated 5G smart surveillance solution, featuring the Nura 4K camera and MG54AX router, provides real-time detection of incidents such as falls and unauthorized intrusion, rendering it high suitable for both residential and public area security applications.In the domain of 5G infrastructure, Pegatron will display two all-in-one gNB Small Cells: the outdoor PS2400 and indoor PS1400. These units adeptly integrate Radio Unit (RU), Distributed Unit (DU), and Central Unit (CU) functionalities, thereby simplifying deployment and supporting 128 to 256 user connections. This makes them the ideal solution for Small and Medium-sized Enterprises (SMEs) and diverse edge computing scenarios.The PR1450 series, specifically designed for seamless indoor 5G connectivity, will also be prominently featured. This 5G FR1 4T4R O-RU is compliant with 3GPP Rel-16. It delivers ultra-reliable low-latency communications (URLLC) micro-slot, provides optimized bandwidth utilization, ensures lower power consumption, and operates effectively across a wide temperature range. These advanced capabilities make the PR1450 series exceptionally well-suited for demanding environments, such as warehouses, showcasing Pegatron's strong steadfast commitment to providing its customers with leading-edge technology and applications within the 5G landscape.Consumer, aesthetic & assisted livingResponding to the burgeoning global beauty technology market, Pegatron is set to introduce the "PRIIö" home beauty device, underscoring its robust R&D and manufacturing capabilities and its strategic initiative to penetrate the high-potential skincare market.Leveraging its leading position in electronic product manufacturing and precision assembly, Pegatron integrates advanced technologies such as Elastic RF, Lifting Microcurrent (EMS), Ion Import/Export (ION), Enrichment Pulse (E-Pulse), Fine Light Therapy (LED MATRIX), and Rapid Cooling into the PRIIö product. This integration offers users a professional-grade skincare experience at home. The launch of PRIIö will not only strengthen Pegatron's presence in smart living and health technology but will also provide consumers with efficient, safe, and user-friendly home beauty solutions.In response to the escalating consumer appetite for premium home beauty solutions, Pegatron will further bolster its investment in R&D resources, driving innovation in beauty technology and aiming to become a key force in shaping future beauty tech trends.Pegatron has also actively expanded into the health assistance sector, demonstrating its commitment to technological innovation and social responsibility. In 2024, the company initiated its ''retinal projection device project,'' aiming to leverage cutting-edge technology to improve the quality of life for individuals with low vision, empowering them to rediscover the visual world. This initiative extends beyond a mere technological breakthrough—it embodies a profound commitment to social responsibility. Through close collaboration with experts and end-users, the design team is dedicated to creating a product that genuinely transforms the lives of individuals with visual impairments. Pegatron firmly believes that the true value of technology lies in its capacity to instill hope and drive positive change for everyone.As part of its ongoing ESG commitment, Pegatron aspires to be a leader in socially responsible innovation, ensuring that its technology serves as a force for compassion and inclusivity. The realization of this retinal projection device marks not only a milestone in technological innovation but also a powerful promise to equality and care.Pegatron cordially invites all sectors to visit us at Computex 2025, Booth L0118, to experience its latest achievements in technological innovation and explore the infinite possibilities of future technology together.Pegatron Corporation Website: https://www.pegatroncorp.com/Pegatron SVR Website: https://svr.pegatroncorp.com/Pegatron 5G Website: https://5g.pegatroncorp.com/

INFINITIX, Taiwan's leader in AI infrastructure, today announced its AI-Stack platform has won the prestigious COMPUTEX "Best Choice Award – Computer & System Category" and the Taiwan Artificial Intelligence Association's "AI Award – Best Solution." These distinguished honors highlight INFINITIX's breakthrough innovation in AI resource orchestration. Visit Booth I0006, Hall 1 during COMPUTEX Taipei (20-23 May) for live demonstrations."Recognition as Taiwan's leading compute resource management brand validates our commitment to AI resource scheduling innovation," said Wen-Yu Chen, CEO. "AI-Stack effectively eliminates GPU bottlenecks throughout the entire AI development and deployment lifecycle."Revolutionary GPU technologyAI-Stack's proprietary technology delivers unprecedented efficiency through• Dynamic partitioning of GPUs into secure virtual instances for parallel workloads• Seamless aggregation of multiple GPUs across nodes for distributed computingThese advanced capabilities consistently deliver over 90% GPU utilization, significantly reducing operational costs while accelerating insights and time-to-market.AI‑Stack further distinguishes itself with an intuitive user interface, comprehensive multi‑cloud management, seamlessly integrated open‑source deep‑learning tools, end-to-end MLOps functionality, and automated single‑ or batch‑task execution—making it a truly comprehensive AI infrastructure operating system.Expanded features drive market growthCOO Chung-Yi Chen announced the strategic addition of an Elastic Training Service for optimized distributed training and a sophisticated Model-as-a-Service (MaaS) module for streamlined deployment. AI-Stack now serves diverse sectors including finance, semiconductor, healthcare, and manufacturing.To meet growing regional demand, INFINITIX is expanding its market presence with new offices in Singapore, Hong Kong, South Korea, and Japan. The company will also make its debut at AI EXPO Korea (Booth K27, 14-16 May, COEX Hall A, Seoul).See the future of AI infrastructure and AI-Stack's capabilities firsthand. Visit www.infinitix.aiAbout INFINITIXBeyond AI, to infinity INFINITIX Inc. has specialized in GPU resource scheduling and AI infrastructure management since 2017. With advanced technical expertise and proven cross-industry success, we continually set benchmarks in enterprise AI computing. In 2021, we became Taiwan’s sole member of NVIDIA’s prestigious global "Solution Advisor" program in AI software—a rare international distinction. Our innovation also earned us the "2024 AMD GPU Ecosystem Construction Partner Award," cementing our strategic position with two global semiconductor leaders. INFINITIX will continue partnering with global tech leaders to strengthen the AI ecosystem and deliver practical solutions, empowering enterprises to achieve strategic breakthroughs and fast track their data driven future. For more information, please visit INFINITIX website: https://www.infinitix.ai/en/Credit: INFINITIX