Cypress Technology (CYP) has introduced its latest 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking, designed to meet the demands of real-time video transmission, remote control, and multi-source display management. The device integrates high-resolution video processing, scaling, multi-window display, and USB mouse control, providing a plug and play, intuitive, and flexible solution for professional environments. It is particularly suited for emergency operation centers, surveillance rooms, conference rooms, and multi-source display scenarios such as seminars and educational spaces.Flexible Multi-Window Display with Seamless switchingThe seamless switching matrix supports four input sources (two HDMI and two USB-C) and offers flexible viewing options including single full-screen, quad-view, picture in picture (PiP), and picture on picture (PoP) modes, outputting to two HDMI displays. The seamless switching technology ensures instant video transmission without delays or black screens in both matrix and multi-window modes, maintaining stable and continuous visuals for mission-critical decision-making or uninterrupted presentations.Intuitive Window Layout Control and Multiple Management OptionsUsers can resize windows and adjust window position directly with a mouse, or control the system via front panel buttons, on-screen display (OSD), Telnet, or RS-232. The system allows storing multiple custom window layouts for quick recall and uses highlighted borders to identify the active window, streamlining operations and improving workflow efficiency.Integrated USB Docking for Collaboration and Device ManagementWith a built-in USB docking function, the device supports keyboard and mouse control across multiple windows and also connects to USB cameras and storage devices. This eliminates the need for an external USB docking station, enabling streamlined video display and data access. It is ideal for control centers, command operations, and multi-tasking collaborative meetings, providing a simple, flexible, and real-time operating experience.High-Quality AV Performance with Broad CompatibilitySupporting resolutions up to 4K60Hz 4:4:4, the device is fully compliant with HDCP 1.x and HDCP 2.2 standards, ensuring secure, high-quality AV transmission. Audio support includes 2-channel LPCM, Dolby Digital, DTS 5.1 channel pass-through output, with the ability to independently select audio sources or switch via USB control, meeting the needs of modern conference and multimedia integration.High-Efficiency USB-C Input with Power DeliveryThe two USB Type-C ports support USB 3.2 Gen 1 with DisplayPort Alt Mode, delivering up to 45W and 30W of power. This allows laptops, tablets, and mobile devices stay powered while in use, enabling users to focus on meetings and video monitoring with improved efficiency.As the demand for synchronized video, remote control, and multi-source integration continues to grow in control rooms and multifunctional meeting spaces. CYP’s 4K60 4:4:4 Seamless Matrix with USB 3.2 Docking stands as a vital core device for next-generation smart collaboration environments. With its flexible multi-window layout, intuitive USB control interface, and support for high-resolution visuals. CYP once again demonstrates its R&D expertise and depth of application in the professional AV industry, providing users with reliable, easy-to-deploy, and highly adaptable video integration solutions. Click here for more product information.4K60 444 Seamless Matrix with USB3.2 Docking. CYP4K60 444 Seamless Matrix with USB3.2 Docking in Control Room. CYP

As Taiwan's high-tech manufacturing and semiconductor sectors play an increasingly critical role in the global economy, companies are accelerating their overseas expansion to navigate rising geopolitical risks and supply chain realignments. These strategic moves aim to diversify operational risks, reduce manufacturing costs, get closer to end markets, and improve delivery speed and service efficiency, while meeting the global demand for supply chain security.However, expanding abroad comes with significant challenges, such as talent shortages, skills gaps, cultural and language barriers, and local regulatory compliance. That's where the right partner makes all the difference. A global leader in IT services and consulting, HCLTech brings robust capabilities in engineering R&D, digital transformation, cloud services, and AI. The company distinguishes itself through flexibility, rapid deployment, and strong localization support, three competitive edges that make it the partner of choice for 50% of Fortune 500 companies and 40% of the Global 2000, spanning industries such as high-tech manufacturing, semiconductors, finance, and automotive.“Setting up operations overseas requires more than just technical know-how, it involves understanding local tax policies, labor laws, and communicating effectively with governments, suppliers, and the workforce,” said Terry Tai, General Manager of HCLTech Taiwan. “Without proper support, language barriers or regulatory missteps can delay projects or inflate costs.”With $13.8 billion in revenue in FY25, a presence in 60 countries, and a global team of over 220,000 professionals from 167 nationalities, HCLTech is equipped to help companies establish operations across the US, Europe, and Southeast Asia. Its local teams offer culturally fluent and technically proficient support to minimize risks and ensure smooth setup and operation.A Trusted Partner for Semiconductor Leaders WorldwideHCLTech’s proven expertise is reflected in numerous global success stories. For instance, when a leading Taiwanese technology manufacturer expanded into India, it faced local system integrators struggling with ERP implementation and post-launch maintenance. Turning to HCLTech, the company deployed a bilingual team to manage coordination and swiftly completed IT infrastructure setup, data migration, and system testing, launching the plant within a short timeframe. It’s a textbook example of how HCLTech supports clients �ufrom plant setup to go-live�v.Tai further highlighted HCLTech's deep partnerships within the global semiconductor industry. The company supports IC design houses and semiconductor equipment vendors with comprehensive services, from RTL, Functional Verification, Physical Design to design verification (DV). These services address talent shortages by providing both technical solutions and support in recruiting and training skilled professionals.“Taiwan remains a global hub for semiconductor innovation,” Tai said. “However, when companies expand abroad, they often encounter challenges in finding local talent or addressing skill gaps, which can delay local operations. Beyond our engineering services, we help bridge that talent gap with tailored recruitment and workforce development solutions.”Notably, HCLTech is a member of TSMC's Design Center Alliance (DCA) and Samsung’s SAFE(Samsung Advanced Foundry Ecosystem) ecosystem. This membership allows the company to provide IC design customers with advanced process enablement and technical services that accelerate time-to-market and enhance competitiveness.AI-Powered Innovation to Shape the FutureAs AI technologies evolve and adoption expands, enterprises are increasingly eager to integrate AI into their operations. HCLTech has long invested in this space, offering proprietary platforms such as “AI Foundry and AI Force ”, designed to streamline data preprocessing and optimize AI applications. These tools have helped Taiwanese companies in sectors like manufacturing, semiconductors, and automotive improve efficiency and reduce costs.In IT service management, AI reduces the need for human agents by automating request classification and delivering instant online responses to user inquiries and issues. This significantly lowers labor costs and processing times, thereby helping maintain the stability and efficiency of enterprise systems.“In the semiconductor domain, we've implemented AI in optimizing DV scripts and automating code conversion, speeding up verification and reducing reliance on senior engineers,” Tai explained.In the automotive field, HCLTech supports clients in software-defined vehicles (SDVs) and advanced driver-assistance systems (ADAS). The 2024 acquisition of Germany's ASAP Group, an engineering service provider specializing in autonomous driving and connected vehicles enhances HCLTech's capabilities. Additionally, HCLTech collaborates with major automakers on smart manufacturing and digital innovation.With the accelerated pace of automotive system development and the growing importance of over-the-air (OTA) software updates powered by increasingly high-performance automotive chips, HCLTech offers technical support that complies with rigorous industry standards such as ISO 26262, ISO 21434, and ASPICE, making it a valuable partner for automotive electronics suppliers, including those in Taiwan.HCLTech also collaborates with partners like SAP and ServiceNow to build the next generation of AI-enabled enterprise solutions. In December 2024, HCLTech announced the opening of an SAP AI Innovation Lab in Munich, Germany. This strategic partnership with SAP's headquarters focuses on helping clients accelerate their transformation to SAP S/4HANA Cloud through RISE with SAP and SAP Business AI.HCLTech partners with ServiceNow to deliver GenAI-based solutions that enable personalized and seamless omnichannel user experiences. The collaboration ensures improved user engagement across all devices and at the right moments.Looking ahead to 2025, the company will focus on three strategic priorities: deploying AI-driven solutions, strengthening vertical industry support, and deepening localization capabilities. To date, HCLTech has introduced AI platforms and modules tailored to key industries, semiconductors, finance, and high-tech manufacturing helping enterprises derive actionable insights from data, accelerate decision-making, and shorten innovation cycles.Terry Tai, General Manager of HCLTech Taiwan. HCLTech

As vehicles become increasingly intelligent and connected, the complexity of electronic/electrical (E/E) systems is growing exponentially. The automotive industry faces unprecedented cybersecurity challenges. Attackers are no longer theoretical threats—they are real entities capable of remotely controlling critical vehicle functions and stealing sensitive data. To address this escalating situation, the International Organization for Standardization (ISO) and the Society of Automotive Engineers (SAE) jointly released the ISO/SAE 21434 standard, providing a comprehensive and authoritative framework for cybersecurity engineering in road vehicles. This standard is not just a technical guide but a fundamental engineering directive that embeds cybersecurity throughout the entire lifecycle of automotive products.Lifecycle Imperative: Security Begins with Design, Not After the FactThe core philosophy of ISO/SAE 21434 is its comprehensive coverage of the entire product lifecycle, marking a paradigm shift in automotive safety thinking. Traditionally, security was considered a late-stage add-on or a reactive measure after vulnerabilities were discovered. However, the 21434 standard clearly states that such reactive approaches are no longer sufficient. Cybersecurity considerations must span every phase—from concept design, product development, manufacturing, operation, maintenance, to final decommissioning.This "Security-by-Design" methodology means cybersecurity must be a core design parameter from the earliest stages of a project. The standard applies to all E/E systems, software, hardware components, and interfaces within road vehicles. This leads to a critical conclusion: every component in the system, no matter how small, becomes part of the cybersecurity chain. Even a seemingly insignificant memory chip can directly impact the cybersecurity posture of its ECU and the entire vehicle. Therefore, choosing components like memory during the concept phase is no longer just about performance and cost—it's a strategic security decision.The complexity of the automotive supply chain further emphasizes this point. From OEMs to Tier 1 and Tier 2 suppliers, collaboration is tight. ISO/SAE 21434 provides a common language and framework to ensure cybersecurity responsibilities and requirements are clearly communicated and enforced throughout the supply chain. For hardware components like NOR Flash, adherence to secure development processes and verifiable security features becomes a prerequisite for Tier 1 or OEM integrators to meet the standard.Core Pillars: CSMS and TARA as Dual Engines of ComplianceTo implement lifecycle security, ISO/SAE 21434 establishes two core pillars: the Cybersecurity Management System (CSMS) and Threat Analysis and Risk Assessment (TARA).Cybersecurity Management System (CSMS)CSMS is a systematic, risk-based approach that defines organizational policies, processes, rules, and responsibilities to continuously manage cybersecurity risks. It’s not a product but a management framework that must be built, implemented, and maintained by the organization. The goal is to foster a "cybersecurity culture" and integrate security considerations into daily operations.Threat Analysis and Risk Assessment (TARA)While CSMS operates at the organizational level, TARA is the technical engine. It is the cornerstone of ISO/SAE 21434—a structured process to identify potential threats, analyze attack paths, assess impact and feasibility, and determine risk levels to guide mitigation decisions. TARA bridges abstract threats with concrete technical countermeasures.For example, TARA might identify a threat scenario like "an attacker physically tampering with ECU firmware." The asset at risk is "firmware integrity." To mitigate this, the system needs cybersecurity controls. Secure NOR Flash provides hardware features like write-protected blocks and cryptographic boot code verification (secure boot), which serve as these controls.Thus, the choice of NOR Flash directly affects TARA outcomes. A standard NOR Flash might rate the feasibility of firmware tampering as "high," resulting in an unacceptable risk level. In contrast, Secure NOR Flash with robust security features could reduce feasibility to "low" or "very low," significantly lowering overall risk.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Mapping Secure NOR Flash Features to ISO/SAE 21434 RequirementsSecure Boot is the cornerstone of any secure electronic system. It is a rigorous verification process that ensures every stage of software execution from power-on is authorized and untampered. This process begins with an immutable Hardware Root of Trust (RoT) and builds a complete "Chain of Trust." If Secure Boot is bypassed, attackers can load malicious firmware and gain full control of the ECU.A key activity in the TARA process is identifying critical system assets and defining controls to protect their confidentiality and integrity. These assets may include cryptographic keys, digital certificates, proprietary algorithms, user privacy data, or vehicle identifiers. Storing these sensitive assets in unprotected memory is akin to leaving a safe's key under the doormat.Secure NOR Flash provides multi-layered hardware mechanisms to protect these assets:- Configurable Secure Memory Regions- Hardware Block/Sector Protection- Built-in Cryptographic Engine and Encrypted CommunicationGlobalized and decentralized automotive supply chains introduce new risks, such as counterfeit or unauthorized components entering production lines or the aftermarket. These "component swapping" or "ECU cloning" attacks are key threats identified in TARA. Secure NOR Flash provides robust hardware authentication mechanisms to counter these threats, directly addressing ECU cloning and forgery threats identified in TARA. These mechanisms ensure supply chain security and component authenticity during production, and establish hardware-based trust between processor and memory—a core principle of secure design.Summary Table: Threat Scenarios and Secure NOR Flash CountermeasuresSummary Table: Threat Scenarios and Secure NOR Flash Countermeasures. WindbondConclusion: From Chip-Level Security to System-Wide ResilienceIn conclusion, the automotive industry is at a turning point where security is no longer optional—it is a prerequisite for market access. In this context, system architects and engineers must recognize that investing in foundational components is an investment in system-wide trust.In the new era of automotive cybersecurity defined by ISO/SAE 21434, memory component selection is no longer a simple engineering decision based on capacity, speed, and cost. It has become a foundational and strategic decision that profoundly impacts the overall security posture of the system.Winbond's secure flash memory solutions help system manufacturers meet regulatory compliance and enhance platform security. To learn more about Winbond’s secure flash memory products, please visit Winbond's TrustME.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

Holtek Semiconductor will exhibit at Electronica India 2025, held from September 17 to 19 at the Bangalore International Exhibition Centre (BIEC). As one of South Asia’s leading trade fairs for electronic components and production technologies, the event is organized by Messe Munchen, Germany.At the exhibition, Holtek will showcase its latest technological developments and market-ready solutions. Featured applications include:1. Electric Two-Wheelers: Central controller unit, BLDC motor controller, dashboard display, battery management, and anti-theft control.2. BLDC Motor Solutions: High/low voltage ceiling fans, pedestal fans, air coolers, and BLDC e-chimneys with touch and gesture control.3. Health Products: Blood pressure monitors, glucose meters (BGM & CGM), ear thermometers, pulse oximeters, and electronic scales.4. Smart Energy & Safety: Energy storage inverters, smoke detectors, gas sensors, safety lights, and human presence detection.5. Wireless Control: Wireless doorbells and remote-control systems.Supporting India’s "Make in India" initiative, Holtek will also present touch-control reference designs for small home appliances, including Continuous low-power induction cooker solutions for local recipes.Headquartered in Hsinchu Science Park, Taiwan, Holtek set up its Indian subsidiary in Bangalore in 2018, followed by a North India branch in New Delhi in late 2024 to expand localized support and services.Holtek warmly welcomes all customers and partners to visit our booth for further discussions and collaboration opportunities.Event Website: electronica-india.comVenue: BIEC, Bangalore, IndiaBooth: H3. E27Dates: September 17–19, 2025

The subscription economy has become the pulse of the online entertainment business. Netflix was the first to popularize the international binge-watching model, and Spotify followed suit by making monthly music access the standard. Although Twitch functions differently and is based on live streaming, it has created a system in which recurring payments through subscriptions and donations have become one of the key factors in the platform's success.This dependence on subscriptions has enabled these companies to become highly advanced financial operators. They must cope with periodic billing schedules in numerous currencies, fluctuating exchange rates, and international financial regulations. They are, in a sense, mini banks, moving billions of dollars a month through their systems. On the consumer side, the ease of having one button to subscribe or unsubscribe hides the complex financial plumbing that goes behind the scenes.Payments as Core Platform FeaturesPayment innovation has become integral to the entertainment experience, extending beyond subscriptions. Twitch introduced direct consumer-to-creator payments through bits, tips, and memberships. Spotify added paid fan subscriptions, and Netflix has experimented with ad-supported tiers, altering its revenue model.These payment systems are no longer peripheral—they are central. When users regularly send small payments to creators or platforms, the service functions similarly to financial platforms that facilitate microtransactions. Unlike traditional banks, however, these processes are gamified and embedded within entertainment, leading analysts to increasingly view them as hybrid entertainment-finance ventures.Lessons Learned in Finances in Other Digital ArenasStreaming companies share similar financial goals with those in the digital world. Online gaming, for example, has long shown that the boundary between play and payment is blurred. The emergence of the new MGA casino environment demonstrates how entertainment companies can serve as financial agents, handling deposits, withdrawals, and regulatory oversight, all while maintaining a focus on the user experience. Equally, Netflix, Spotify, and Twitch are getting to grips with the need to combine smooth entertainment with high-end financial architecture.The moral of the story is that people no longer distinguish between entertainment and payments. They want the process of spending money to feel normal and as frictionless as possible when they are funding a favorite streamer, purchasing access to an exclusive playlist, or upgrading to an ad-free tier. This anticipation is driving platforms to expand their financial capacities, positioning them more like banks that deal with consumers.Creator-Centric EconomiesStreaming platforms also resemble financial institutions in their relationships with creators. Twitch supports millions of streamers earning income through the platform. Spotify, despite ongoing debates about royalty structures, pays billions annually to artists. Netflix has taken a more direct role by financing original productions rather than solely licensing content.In these cases, platforms collect payments from consumers and distribute earnings to creators—mirroring how financial institutions manage deposits and withdrawals. These large-scale financial flows require robust payment networks, compliance systems, and fraud prevention tools. As creators demand faster payouts and greater transparency, platforms are under pressure to match the efficiency of fintech startupsThe Future of Financial InnovationLooking ahead, the financial dimension of entertainment platforms is poised to expand. Spotify may explore blockchain-based royalty tracking, Netflix could introduce micro-subscriptions for individual shows, and Twitch might adopt stablecoins for cross-border tipping. These developments would further solidify their dual roles as entertainment providers and financial facilitators.Moreover, these platforms possess a significant advantage: data. Their deep understanding of user spending habits positions them to create personalized financial products. Netflix could offer loyalty credits, Spotify might launch fan investment plans, and Twitch could develop financial planning tools for creators. The boundaries between streaming, gaming, and fintech will continue to blurThe Bankers of Digital CultureNetflix, Spotify, and Twitch are not traditional banks with vaults or branches, but they increasingly perform similar functions. They process billions in payments, manage complex financial relationships with creators, and continually innovate how money flows through their ecosystems. While users are drawn by content, they stay for the seamless integration of finance and entertainment.In the future, online entertainment will encompass not only what we watch, listen to, or play—but also how platforms manage and monetize financial interactions. The roles of banker and entertainer are converging in the digital age.

SK hynix Inc. announced today that it has started supplying mobile DRAM products with highly efficient heat dissipation by adopting the High-K Epoxy Molding Compound material for the first time in the industry.The development comes as heat generated in the process of fast data transfer for on-device AI applications results in performance degradation of smartphones. Global smartphone companies welcome the launch of the product on expectations that it will help address the heat issue of high-performance flagship smartphones.The structure of package on package, or PoP, that most flagship smartphones adopt and stacks DRAM onto the application processor, allows efficient use of limited space, while improving data transfer speed. Such system, however, also triggers a performance degradation of the device itself as heat generated within the mobile AP stays inside DRAM.SK hynix found the solution in improvement of thermal conductivity of EMC, a critical material that covers DRAM package and developed High-K EMC by adding Alumina to Silica, which has been adopted for EMC material so far.With thermal conductivity improved by 3.5 times and thermal resistance in the vertical course of the heat improved by 47%, the new technology is expected to contribute to a longer battery runtime and product lifespan by improving performance of a smartphone and reducing power consumption."It's a meaningful achievement that goes beyond a simple performance improvement as it addresses the inconvenience that many high-performance smartphone users may have had," Lee Gyujei, Head of Package Product Development, said. "We are committed to firmly establishing our technological leadership in the next-generation mobile DRAM market with our technological innovation in materials."Credit: SK HynixSK hynix develops the industry's first mobile DRAM with High-K EMC, enabling advanced thermal management for next-gen on-device AI. SK Hynix

Energy efficiency is often described as the "first fuel" of the global energy transition, as it offers some of the fastest and most cost-effective ways to reduce CO2 emissions. It not only helps lower energy bills but also strengthens energy security by reducing dependence on fossil fuels. However, the energy transition, particularly in industries, remains a complex challenge with a myriad of barriers slowing the adoption of energy-efficient technologies.One often-overlooked opportunity can be found in electric motors, which account for over 45% of global electricity consumption and power a vast range of industrial applications. Improving the efficiency of these motors present significant energy savings with the potential to reduce global electricity consumption by up to 10%.In this interview, Mike Umiker, Managing Director of the Energy Efficiency Movement (EEM), shares insights on global efforts to accelerate energy efficiency progress and the opportunities it presents for Taiwan. The EEM, founded by ABB in 2021, serves as a collaborative platform that unites like-minded stakeholders committed to driving innovation and action toward a more energy-efficient future. Today, the Movement has grown to include over 600 organizations and companies worldwide.Barriers to energy efficiency adoptionWhile the benefits of energy efficiency are widely acknowledged, its adoption is not universally straightforward. The logic behind adopting energy-efficient practices may not resonate across all sectors and regions. Different drivers influence adoption in different ways, and what works in one context may not be effective in another.Despite the availability of numerous energy efficiency solutions and technologies, their widespread and rapid implementation continues to face significant obstacles. In the interview, Umiker highlights findings from the Energy Efficiency Movement's recent survey in a report titled "Efficiency NOW". He explains that many companies, although aware of the advantages, encounter internal barriers that hinder progress. These include financial constraints, infrastructure limitations, a lack of skilled personnel, strategic gaps and challenges related to data and control systems.The survey highlights 5 main barriers to adopting energy efficiency measures. The first is financing with 43% of respondents citing it as the highest barrier and stating uncertain returns on investment as a key challenge. Second is infrastructure, with 19% of companies being affected. Interestingly, about 1 in 2 companies struggle with shortage of skilled workers, hindering energy efficiency ideation and implementation.Responding to these key obstacles, Umiker suggests three targeted action to accelerate energy efficiency adoption:1.Establishing dedicated budgets or exploring alternative financing models such as equipment-as-a-service to enable access to energy-saving technologies and services without the burden of large upfront capital investments.2.Investing in data infrastructure and real-time analytics to empower organizations with continuous performance monitoring and deeper insights into energy consumption patterns, helping to identify areas for improvement.3.Driving strategic alignment through clear KPIs and ROI modeling, ensuring that energy efficiency initiatives are integrated into broader business objectives and performance metrics.Scaling Up Industrial ImplementationWith around 300 million industrial motor-driven systems in operation worldwide, global energy consumption could be reduced by up to 10% if these systems were replaced with high-efficiency equipment. This is where ABB plays a pivotal role, Umiker noted.As of July 1, 2023, electric motors with power ratings between 75 kW to 200 kW sold within the EU are required to meet the IE4 energy efficiency standard, an upgrade from the previously mandated IE3 level. In response to this, ABB introduced next-generation electric motor systems, including the newly developed IE6 SynRM motors, as part of its Top Industrial Efficiency (TIE) initiative. These systems exceed standard performance benchmarks, helping customers reduce electricity usage, operating costs, and total cost of ownership (TCO), all without compromising performance or adding complexity. Notably, one of ABB's TIE motors, destined for a steel plant in India, achieved a record-breaking efficiency rating of 99.13% during testing, surpassing ABB's previous world record of 99.05% set in 2017.In Taiwan, the Minimum Energy Performance Standards (MEPS) for low-voltage, three-phase, squirrel-cage induction motors with a rated output power of 75kW or greater will require IE4 efficiency levels, starting July 1, 2025, while motors below 75kW will need to meet the IE3 standard. The regulatory shift has prompted proactive investments from the private sectors including several semiconductor manufacturing companies which are now investing in large scale energy efficiency initiatives. New purchase orders have been placed for a total of 122 high-efficiency drives, intended for pump and fan applications. These ABB Variable Speed Drive (VSD) Inverters are designed to save energy, reduce operating costs and minimize unscheduled downtime.According to Vincent Wu, Head of ABB Taiwan's Motion business, these developments are helping to sustain strong momentum for energy efficiency adoption across the country. Taiwan's progress is already notable, with an average annual energy efficiency improvement of 5.4% over the past five years, surpassing the 4% target set at the 28th U.N. Climate Change Conference (COP28).Joining the Energy Efficiency Movement is Simple and SeamlessJoining the Energy Efficiency Movement (EEM) presents a powerful opportunity to advance energy efficiency through shared knowledge, collaboration, and customized training. Movers gain access to practical insights and valuable resources that support the swift and seamless implementation of energy-efficient solutions. By becoming part of a global network of like-minded organizations, companies or organizations can exchange best practices, form strategic partnerships, and accelerate meaningful change.Visit the EEM website today to learn more and take your first step toward a more energy-efficient future. https://www.energyefficiencymovement.com/Mike Umiker, Executive Director of EEM, with Yu-Ren Liu, Sales Manager of GEORDING MACHINERY. ABBMike Umiker, Executive Director of EEM, with Victor Wu, Vice President of SUCOM ELECTRIC. ABBMike Umiker, CEO of EEM, with Vincent Wu, Vice President of ABB Taiwan Motion Business. ABB

Every town has its fixtures. The postman with the half-wink, the dog that sits outside the news agent as if guarding the broadsheets, the elderly gent in the cap who always arrives at the bus stop exactly twelve minutes before the bus is due. In the world of cryptocurrency, Bitcoin has taken that role of the fellow in the shiny jacket who insists on telling you his plans before you've even put your bag down. Litecoin, by contrast, is the shopkeeper you've known for years. The one who doesn't rush to greet you but knows precisely which brand of biscuits you’re after and has them wrapped before you've said a word.And yet, for all its quiet ways, Litecoin has had quite a year. The Litecoin price at this moment stands at $127.69 — a rise of 100.98 percent in twelve months. The market cap is brushing $9.73 billion, with a day's trading volume tipping $1.04 billion. These aren't the shaky figures of a hopeful start-up. This is the sort of balance sheet that would have certain overconfident coins blushing if they could manage the self-awareness.An Old Hand Still Moving BrisklyWhat's notable is that despite its age, Litecoin hasn't become entirely passive. The rise to its current value isn't random—it reflects consistent efficiency, including faster transaction speeds, modest fees, and a reliability that allows users to send it with confidence, rather than anxiously refreshing the screen like they're watching an eBay bid count down.The cryptocurrency market is, by its nature, drawn to novelty. New coins appear with fancy logos and slogans, offering grand visions for the future. Some barely last longer than a summer romance, gone before you’ve even learned to pronounce their names. Litecoin, though, belongs to the group that turns up, does the work, and keeps turning up.It's reminiscent of those actors who never get their name above the title but appear in every film worth seeing. Judi Dench won an Oscar for just eight minutes of screen time, and Litecoin could be seen as playing a similar role for over a decade—not the biggest name on the poster, but often the one holding the scene together.The Gap Between Now and ThenHere's the part that turns the heads of the more thoughtful investors: Litecoin's all-time high was $410.26. That's not yesterday's news; it's a reminder that the coin has been valued far higher and could, given the right conditions, make a return journey. The current price, less than a third of that, offers a sort of measured intrigue. There's room for movement without the pressure-cooker atmosphere that accompanies a coin at peak value.And then there's scarcity. A circulating supply of 76.18 million coins might not sound scarce compared to fine art or vintage wine, but in crypto terms it's a reassuring limit. It means each unit matters, and that matters when so many coins dilute themselves into irrelevance by flooding the market.Why the Overlooked Often Last the LongestThe market often treats coins like Litecoin — or Dash, or Monero — as supporting acts. They're talked about in passing, overshadowed by the ones in the news. But in a sector where hype can burn through a project faster than any security flaw, being under the radar is a kind of shield. Litecoin doesn't have to keep proving its worth with stunts. Its worth is in having survived, adapted, and kept its integrity intact.This is why its one-year chart doesn't look like a heart monitor during a penalty shootout. Even in the months where the price dipped, it did so in a way that suggested recovery was a matter of "when"rather than "if".The Everyday AppealFor newcomers, Litecoin's appeal is often practical. It's more affordable than many household-name coins, and there's a certain satisfaction in owning an entire coin rather than a fractional amount like 0.0043. It's akin to having a whole cake rather than just a sliver on a plate—even if, in practice, it's not consumed all at once.It's also nimble in use. Transactions are fast, fees are modest, and it functions without requiring deep technical expertise. That level of usability is essential if cryptocurrency is to become something accessible to everyday users, rather than feeling like enrollment in a correspondence course.Looking Forward Without the HysteriaWhere Litecoin goes from here will depend on the usual collection of influences: the mood of the market, the pace of blockchain development, the tug-of-war between regulation and freedom, and whether more people start using it in everyday life. It's not a mystery, and the coin's history suggests it won't be left behind.If you put the figures together — billions in market cap, billions in daily volume, and a price comfortably below past highs — it's the sort of picture that would make the cautious optimist nod. Not so low as to be risky in the wrong way, not so high as to be top-heavy. Just the middle ground where sensible progress tends to happen. Of course, as with any investment, it's important to do thorough research and make decisions based on individual risk tolerance and long-term goals.Understanding the Role of Coins Like Litecoin in the Crypto Ecosystem. Pexel

Reuters Events is proud to present Momentum AI Asia 2025, a premier conference that brings together Asia's most influential AI leaders to tackle the region's most pressing challenges in AI adoption.Taking place on September 17, 2025, at the Amara Singapore, Momentum AI Asia 2025 will feature an impressive lineup of 30+ executive speakers, including Tom Lue, Vice President of Frontier AI Global Affairs at Google DeepMind, Mihaela Isac, Chief Information Officer at DHL Supply Chain Asia Pacific, Lee Wan Sie, Cluster Director, AI Governance & Safety at Infocomm Media Development Authority (IMDA), and Guy Sheppard, Head of AI Strategy & Adoption at Standard Chartered Bank.The event is designed to provide a platform for AI stakeholders to discuss the latest developments, trends, and strategies in AI, with a focus on maximizing impact and ROI. Attendees will have the opportunity to engage in interactive sessions, roundtable discussions, and networking opportunities with over 300 senior attendees, 82% of whom hold director-level positions and above.The conference agenda will explore key themes, including Regional Collaboration, AI Value and Scalability, AI for Competitive Advantage, and AI Readiness and Robustness. With a focus on delivering actionable insights and tangible takeaways, Momentum AI Asia 2025 is the perfect platform for business leaders to future-proof their AI strategies and unlock collaboration opportunities with the region's AI ecosystem."We're excited to bring together the region's AI thought leaders to share insights, best practices, and innovative approaches to AI adoption," said Paul Jacinto, Senior Project Director, Momentum AI Asia "Our goal is to provide a platform for meaningful connections, knowledge sharing, and collaboration, ultimately empowering businesses to harness the full potential of AI."Visit the website to learn more.

ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence Revolution." This refers to the driving forces for new chip technologies like AI, smart mobility, and hyperconnectivity. As a leading provider of advanced packaging and semiconductor assembly solutions, ASMPT enables its customers to develop cutting-edge AI technologies, supporting both high-performance AI chips that integrate advanced memory technologies like HBM and efficient components for edge devices. ASMPT will showcase three machines at SEMICON Taiwan: the new ALSI LASER Platform, the fine-pitch wire bonding solution AERO PRO, and the SIPLACE CA2 uniting semiconductor and SMT processes.ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025.ASMPTThe next-generation LASER platform has been specifically developed to meet the increasingly complex requirements of IDM and Foundry semiconductor companies for laser dicing and grooving wafer materials. This new system with ASMPT's patented multi-beam technology expands the company's portfolio with a focus on front-end operations."The new platform combines high-precision laser processing with smart automation to support the next generation of semiconductor manufacturing", says Patrick Huberts, Head of Business and Marketing at ASMPT ALSI. "It's the ideal platform for applications in advanced packaging, AI, and power automotive. We invite you to join us for the official launch and discover the new machine live at our booth during SEMICON Taiwan."High-performance wire bondingASMPT also introduces its latest high-performance wire bonder at SEMICON: the AERO PRO. Developed for high-density semiconductor designs, this machine delivers the highest bonding accuracy and exceptional speed for wires with diameters of 0.5 mil (≈12.7 µm). Thanks to integrated real-time monitoring and preventive maintenance functions, the system is ideally suited for use in intelligent, networked production environments. To accommodate complex designs such as system-in-package (SiP) and multi-chip modules (MCMs), as well as applications like ball grid arrays (BGAs), land grid arrays (LGAs), memory modules, or quad flat packages (QFPs) with external leads. For uniform 22-µm bond balls, it employs the patented X-POWER 2.0 transducer—a lightweight and vibration-optimized ultrasonic transducer that supports mixed-wire and vertical bonding in bond via array (BVA) technology. Optimized for complex interconnects in memory, microcontroller units (MCUs), and more, ideal for advanced applications such as AI edge devices and automotive systems.Bridging Semiconductor and SMTThe hybrid SIPLACE CA2 placement solution from ASMPT SMT Solutions redefines advanced packaging by uniting semiconductor and SMT processes in a single, high-speed platform. Traditionally, die bonding and SMT placement were separate steps — now, they are seamlessly integrated. Designed for advanced packaging applications in smartphones, 5G, AI, high-performance computing (HPC), and IoT devices, the SIPLACE CA2 processes both SMDs from tape and dies taken directly from sawn wafers. This eliminates the need for expensive die taping, saving up to 800 km of tape annually in 24/7 production, reducing both cost and material waste. With up to 76,000 components per hour (cph) for SMT, 54,000 cph for Die Attach, and accuracy of up to 10nm @ 3σ accuracy, the SIPLACE CA2 delivers high-speed and accuracy — even for advanced Die Attach and Flip Chip applications. A breakthrough buffer system decouples die pickup from placement, solving previous speed limitations. Up to 50 wafers can be managed with just 13 seconds of swap time – unmatched in the industry.The SIPLACE CA2 boosts productivity in advanced packaging by combining classic surface-mount technology with die-attach and flip-chip assembly. ASMPT