As artificial intelligence (AI), high-performance computing (HPC), high-speed networking, and edge computing applications continue to expand rapidly, global demand for custom ASIC solutions is rising at an unprecedented pace...
Smiths Interconnect, a Molex company, announces its top performing distributors in 2025. The Distribution Awards program honors distributors which have made a meaningful impact on the growth of Smiths Interconnect across its three key regions: the Americas, EMEA, and Asia.
Artificial intelligence (AI) is moving beyond a tool that simply answers questions and into the era of "agentic AI"—systems that make their own judgments and carry out tasks. A major event offering a comprehensive view of the latest currents in the global AI industry is once again coming to Seoul.
EDOM Technology(TWSE: 3048), Asia's best solutions provider, celebrates its 30th anniversary this year. Since its establishment in 1996, EDOM has worked with global partners to lead innovative technologies and witnessed the growth trajectory of the electronics industry along the way...
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
On the opening day of COMPUTEX 2026, AIC Inc. hosted a high-level strategic panel session at its booth, focusing on overcoming the "memory wall" challenge...
The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and physical applications, with rapidly evolving artificial intelligence playing an increasingly critical role.
In the past, due to high equipment costs and bulky sizes, thermal imaging technology was predominantly confined to specialized fields such as security surveillance, firefighting and rescue, military defense, and high-end industrial inspection...
The integration of artificial intelligence into the semiconductor industry is no longer merely a competitive advantage - it has become a core driver of modern engineering.
