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High-end handsets drive demand for three-layer HDI boards

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Tuesday 21 April 2009 0

Demand for 3+n+3 high-density interconnect (HDI) boards or above has been pushed up as more handset chip companies, including Qualcomm, Texas Instruments (TI) and STMicroelectronics, have been turning the packaging of handset chips from wire-boding...

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