Japan IDMs outsourcing IC backend production to Chipbond

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Monday 22 June 2009 0

Renesas Technology is closing production lines and plans to release bump and chip on glass (COG) orders to Chipbond Technology, while NEC Electronics already started releasing chip on film (COF) orders to the Taiwan-based maker earlier in June, according...

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