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3D Circuit to ramp up handset-use antenna modules

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia Friday 2 April 2010 0

Taiwan-based 3D Circuit is ramping up its output of handset-use antenna modules, made with its in-house developed 3D LDS (laser direct structuring) process, to 4.2 million units in June from 3.3 million units currently, according to the company.

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