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STATS ChipPAC intros 300mm embedded WLB wafer manufacturing

Press release; Jessie Shen, DIGITIMES Asia Tuesday 13 April 2010 0

STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer manufacturing, customers can benefit from the cost and productivity...

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