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China carmakers explore subscription and modular models as answer to car graveyards

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Qualcomm shifts toward data center chips as AI demand squeezes memory supply

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Samsung DRAM profit lead exposes a new HBM battleground

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Chinese one-time car model draws in Taiwanese electronics and chip suppliers

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Samsung 4nm yield reportedly tops 80% as foundry and memory recovery gains steam

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Win Semiconductors says GaAs and InP supply remains sufficient

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Home Tech Semiconductors

ASE slowing copper wire bonding expansion, says paper

Jessie Shen, DIGITIMES, Taipei

Sep 23, 2010, 16:25 0

Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic Daily News (EDN) report. The chip packaging and testing house plans to...

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iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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