CONNECT WITH US

STATS ChipPAC increasing copper-wire bonding output

Ingrid Lee, Taipei; Adam Hwang, DIGITIMES Asia 0

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to increase the cumulative output by 75% at the end of 2010, according to...

The article requires paid subscription. Subscribe Now