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STATS ChipPAC increasing copper-wire bonding output

Ingrid Lee, Taipei; Adam Hwang, DIGITIMES Asia Thursday 2 December 2010 0

Singapore-based STATS ChipPAC has cumulatively packaged 100 million chips based on copper-wire bonding process since it started using the process in November 2009, and expects to increase the cumulative output by 75% at the end of 2010, according to...

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