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SPIL to raise 2010 capex budget for copper wire bonding equipment procurement

Ingrid Lee, Taichung; Willie Teng, DIGITIMES Asia Thursday 17 June 2010 0

Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement of copper wire bonding equipment, according to the Taiwan-based company...

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