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Monday 17 February 2025
DIGITIMES exclusive: Inside MediaTek's SiPh strategy and the shift toward heterogeneous integration
MediaTek, a global leader in IC design, has strengthened its presence in the ASIC market by capitalizing on its Serializer/Deserializer (SerDes) technology. As traditional electronic...
Tuesday 11 February 2025
China's demand and South America's production drive global copper market dynamics
Copper has been hailed as "the oil of the new energy sector," playing an irreplaceable role in areas such as power transmission, renewable energy, and electric vehicles (EVs). Specifically,...
Tuesday 11 February 2025
Critical minerals face market uncertainty amid global energy transition and geopolitical risks
The global energy transition is driving unprecedented demand for critical minerals including lithium, nickel, cobalt, copper, and rare earth elements. These resources have become...
Tuesday 4 February 2025
Trump tariffs induce volatility in precious metal prices, potentially hurting packaging houses
US President Donald Trump's new policies have reignited the global trade war, leading to significant fluctuations in international precious metal prices, with gold reaching an all-time...
Thursday 16 January 2025
MediaTek and Himax to challenge US giants with SiPh solutions
Silicon photonics (SiPh) has garnered significant business interest as a technology solution for high-speed data transfer in the era of AI. Currently, leading US chip manufacturers...
Monday 6 January 2025
Fire breaks out at PCB firm Zhen Ding's northern Taiwan plant
PCB manufacturer Zhen Ding Technology has experienced its second fire incident at its Guanyin site in Taoyuan, northern Taiwan, in five years. The origin of the fire and the precise...
Friday 27 December 2024
EcoFlash S300: Revolutionizing fine-line circuit fabrication with undercut-free precision and efficiency
Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and...
Thursday 26 December 2024
SustainaCircuits: Japan's Elephantech unveils general-purpose multilayer PCBs
Elephantech Inc., a Tokyo-based printed electronics manufacturer, has announced a breakthrough in developing general-purpose multilayer printed circuit boards (PCBs). The company's...
Wednesday 18 December 2024
Ventec new Thailand plant set for volume production in 1Q26
Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Friday 22 November 2024
PCB, CCL firms gearing up for 2025 AI server boom
Printed circuit board (PCB) and copper-clad laminate (CCL) manufacturers are positioning themselves to capitalize on the growing AI server demand to drive growth momentum in 2025.
Tuesday 5 November 2024
AUO pivots to silicon photonics over FOPLP race
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Monday 4 November 2024
Generative AI faces bottlenecks from limited data, rising resource demands, and copper shortages
Generative AI requires ample resources, yet challenges such as limited high-quality data, rising freshwater and electricity consumption in data centers, and a widening copper supply...
Thursday 31 October 2024
Ennostar leverages Micro LED for AI optical communication and short-range transmission
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
Thursday 31 October 2024
EMC reports strong performance in 3Q24, plans capacity expansion for 2025
EMC, a leading manufacturer of environmentally friendly high-grade copper clad laminates (CCL), has announced its financial results for the third quarter of 2024. The company reported...
Monday 28 October 2024
Innolux leads with copper-acid electrolysis in green recycling push
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research