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NEWS TAGGED COPPER
Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Thursday 10 September 2026
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026
Gem Terminal rides China plug rule shift for 8.8% sales growth
Gem Terminal Industry said its August 2026 consolidated revenue continued to show steady growth, helped by the approaching conversion deadline for China's new insulation requirements...
Wednesday 9 September 2026
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
Sunday 6 September 2026
Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27
Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...
Saturday 5 September 2026
Topco targets optical comms, cooling as copper gives way
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
Friday 4 September 2026
The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future...
Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...