Following other PCB firms' expansion moves, niche copper-clad laminate (CCL) specialist Ventec announced plans in November for a production base in Thailand, which will begin volume...
Printed circuit board (PCB) and copper-clad laminate (CCL) manufacturers are positioning themselves to capitalize on the growing AI server demand to drive growth momentum in 2025.
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...
Generative AI requires ample resources, yet challenges such as limited high-quality data, rising freshwater and electricity consumption in data centers, and a widening copper supply...
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
EMC, a leading manufacturer of environmentally friendly high-grade copper clad laminates (CCL), has announced its financial results for the third quarter of 2024. The company reported...
Innolux has gained attention for entering fan-out panel-level packaging (FOPLP). The Ministry of Environment recently commended the company for its resource recycling efforts, highlighting...
Applied Materials (Applied) has announced the use of a new material, ruthenium (Ru), in equipment designed to enhance efficiency in advanced semiconductor processes. This initiative...
Electroninks, the leader in metal-organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company's advanced...
Elite Material, a top manufacturer of high-performance copper clad laminates (CCL), has signed a strategic cooperation agreement with Zhen Ding, a global leader in PCB production...
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
Taiwan-based copper clad laminate (CCL) makers Elite Material, Iteq, and Taiwan Union Technology (TUC) are poised for a robust second half of the year, driven by growing demand for...
In the ever-evolving landscape of corporate innovation, Taya Group emerges as a standout player, transcending its origins in wire and cable to advance ventures in satellite technology...
Taiwan's LCY group secured a US$9.5 million financing deal with Nippon Denkai for the Japanese electrolytic copper foils subsidiary DENKAI America Inc., signaling a strategic alliance...
The introduction of new server processors by Intel and Advanced Micro Devices (AMD) will increase RG series copper foil demand through 2024, according to Co-Tech Development, a Taiwanese...
