News tagged copper at DIGITIMES

NEWS TAGGED COPPER

Friday 21 August 2026

JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging

JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...

Wednesday 19 August 2026

Manz Asia targets PLP demand with three lines and three sizes

Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...

Wednesday 19 August 2026

LG's raw material costs jump by over KRW1 trillion in 1H26, auto components hit hardest

Rising chip and copper prices are rapidly increasing cost pressure on LG Electronics.

Tuesday 18 August 2026

Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

Monday 17 August 2026

Lightmatter sets optical interconnect blueprint as AI hits copper wall

AI data centers are approaching a physical limit: as scale-up architectures stretch across multiple racks and SerDes speeds near 448G,...

Friday 14 August 2026

OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026

Gem Terminal's second-quarter profit hits 16-quarter high on copper and connector demand

Gem Terminal Industry said its net profit in the second quarter of 2026 reached a 16-quarter high as niche products and improved production efficiency in Taiwan and Vietnam lifted...

Friday 14 August 2026

Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure

AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.

Thursday 13 August 2026

OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward

Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.

Thursday 13 August 2026

GaAs gains ground in short-reach AI optics as InP constraints mount

As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance...

Thursday 13 August 2026

Can diamond rewrite the rules of AI chip cooling? Wiwynn is putting it to the test

As AI processors become more powerful, one of the industry's most stubborn constraints is becoming increasingly physical: there is only so much heat conventional materials can move...

Wednesday 12 August 2026

OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

Wednesday 12 August 2026

OCP APAC 2026: Cloud AI's growth hits a new bottleneck— networking, not compute

At the 2026 OCP APAC Summit, debate over networking architectures in cloud AI data centers sharpened as industry players said the main...

Tuesday 4 August 2026

MediaTek sees SerDes 448G as copper's final battleground

The question of where the limits of cloud AI high-speed interconnects will fall has been a major market focus over the past six months. MediaTek addressed the issue for the first time...

Friday 31 July 2026

Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

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Aug 20, 11:00

Corning-IRICO Trade Secret Case Enters New Phase

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