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NEWS TAGGED COPPER
Friday 16 October 2026
BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead
Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...
Thursday 15 October 2026
Fujifilm to expand Arizona semiconductor materials output
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era

The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...

Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking...
Tuesday 6 October 2026
Jedec unveils new standard for silicon photonics reliability qualification and testing
Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid...
Tuesday 6 October 2026
Marvell sees custom chips as a must for CSPs
Nvidia CEO Jensen Huang has said Marvell's optical technology could help make it the next trillion-dollar company, and Marvell took a step toward that goal on September 17 by expanding...
Friday 18 September 2026
CPO raises PCB downgrade concerns but switches stick with M8 CCL

As the industry shifts toward greater use of optical interconnects and less reliance on copper, market speculation has emerged that...

Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
As AI data centers hit a transmission wall, GlobalFoundries pushes into silicon photonics
At the China International Optoelectronics Expo (CIOE), a palm-sized metal transceiver represents the shift from copper to light in data center infrastructure, one of the biggest transformations...
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...