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Saturday 7 November 2026
Solidigm eyes US NAND fab as funding questions linger
Solidigm, a subsidiary of SK Hynix, is considering building a NAND flash wafer fab in the US. Funding and the investment timeline have yet to be settled, but DIGITIMES Intelligence...
Saturday 7 November 2026
Samsung reportedly sells 300 chipmaking tools to DB Group
Samsung Electronics has reportedly agreed to sell approximately 300 semiconductor manufacturing tools from its shuttered 8-inch S7 foundry in Giheung to South Korea's DB Group, as...
Friday 6 November 2026
YMTC targets up to 70% Chinese tools for new NAND fab
China's Yangtze Memory Technologies (YMTC) plans to source as much as 70% of the manufacturing equipment for its fourth NAND flash factory from domestic suppliers, a substantial increase...
Friday 6 November 2026
China's chip equipment makers ride record AI orders into 2027, but new challenges lie ahead
Chinese semiconductor equipment makers report record orders extending into 2027, with AI-driven investment in advanced memory, logic chips and packaging strengthening demand for domestic...
Friday 6 November 2026
Samsung speeds P5 Fab 2 construction as memory chip shortage looks to last through 2028
Samsung Electronics plans to begin structural work at its P5 Fab 2 facility in Pyeongtaek, South Korea, in January 2027, accelerating its memory capacity expansion as chip shortages...
Friday 6 November 2026
Commentary: YMTC's record NAND profits mask bigger risks behind its reported IPO delay
YMTC's parent company, CCSH Corporation, had planned to raise CNY33 billion (approx. US$4.93 billion) through an IPO on Shanghai's STAR Market to finance production-line upgrades and...
Friday 6 November 2026
V5 Technologies posts 69.7% revenue growth in first 10 months
V5 Technologies, a major provider of advanced semiconductor optical inspection and image-processing software, reported consolidated revenue of NT$316 million (US$9.61 million) in October...
Friday 6 November 2026
EnliTech revenue jumps 71% in October as SiPh testing accelerates
Optoelectronic chip testing equipment maker EnliTech reported self-assessed consolidated revenue of approximately NT$51.504 million (US$1.57 million) in October 2026, up 71.33% year...
Friday 6 November 2026
DIGITIMES Insight: Foxconn extends AI strategy to data center system integration, targeting modular computing delivery with DSX POD
At Hon Hai Tech Day 2026 (HHTD 26), Foxconn showcased the Nvidia DSX POD containerized solution. By leveraging factory pre-building, electromechanical integration, and pre-testing,...
Thursday 5 November 2026
Advantech sees high-double-digit growth through 2027, driven by AI and semiconductor equipment
Industrial PC leader Advantech reported record quarterly revenue and net profit for the third quarter of 2026, propelled by strong demand across semiconductor equipment, factory automation,...
Thursday 5 November 2026
Advantech sees edge AI growth accelerating beyond semiconductor equipment into robotics
Advantech expects strong growth in 2027, identifying semiconductor equipment, edge AI and robotics as its principal growth engines. The Taiwanese industrial computing company reported...
Thursday 5 November 2026
Chipmakers rush to secure equipment for 2029 as lead times top two years
Chipmakers are moving to secure production equipment for delivery as far ahead as 2029, as AI-driven fab expansion pushes some equipment lead times beyond two years and forces manufacturers...
Thursday 5 November 2026
China's Big Fund III pivots to 12-inch chip fabs, equipment acquisitions to close semiconductor supply chain gaps
China's National Integrated Circuit Industry Investment Fund Phase III (Big Fund III) is shifting its focus from targeted semiconductor investments to large-scale manufacturing and...
Thursday 5 November 2026
Price hikes, market saturation curb global telecom, consumer electronics export growth
Rising global oil prices have driven up food costs, squeezing consumer discretionary budgets for products with higher price elasticity, such as smartphones and consumer electronics...
Thursday 5 November 2026
Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth...