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Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Thursday 11 June 2026
Applied Materials expands Singapore base as AI supply-chain bottlenecks loom
Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment...
Thursday 11 June 2026
Sercomm posts 55% jump in January-May revenue and forecasts 2026 operating growth
Sercomm Corporation said its revenue for the first five months of 2026 hit a record NT$30 billion (US$950 million), up 55% from a year earlier, signaling continued momentum in telecom...
Thursday 11 June 2026
BizLink to buy Interplex Datacom in up to US$900 million deal
BizLink Holding has agreed to acquire Interplex Datacom, the data communications business of Interplex Group, in a deal that will expand its presence in the data center interconnect...
Thursday 11 June 2026
Applied Materials invests US$500 million in Singapore to meet AI chip demand
As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking...
Thursday 11 June 2026
How an alliance of Taiwanese chip suppliers cracked Intel's supply chain with a FOUP solution
TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members...
Wednesday 10 June 2026
Powerchip taps AI-driven chip boom with US$833 million overseas fundraising push
Powerchip Semiconductor Manufacturing Corp. (PSMC) has priced a cash capital increase tied to an overseas depositary receipt offering, a move that may matter to global investors tracking...
Wednesday 10 June 2026
Taiwan exports hit record high as AI servers and chip price hikes fuel trade surge
Taiwan's exports hit new highs in May 2026 and in the first five months of the year, powered by AI supply-chain demand and rising electronics prices, the Ministry of Finance said on...
Wednesday 10 June 2026
AI equipment, telecom upgrades lift network equipment vendors in May
Taiwan-based network equipment makers have seen revenue trend higher in May 2026, buoyed by rising AI infrastructure spending, low Earth orbit (LEO) satellite orders, and a telecom...
Wednesday 10 June 2026
Posiflex sees orders through 3Q26, shuns price war

Posiflex said order visibility for the second and third quarters of 2026 remains relatively clear, though the industrial PC and POS hardware...

Tuesday 9 June 2026
SuperAlloy targets semiconductor supply chain with recycled aluminum push
SuperAlloy reported that rising demand from global luxury and supercar manufacturers, alongside green procurement policies, drove higher sales of recycled aluminum in May, lifting...
Tuesday 9 June 2026
SK Hynix orders Hanmi equipment for HBM4 capacity buildout
SK Hynix has ordered new HBM4 production equipment from Hanmi Semiconductor, a clear signal that the South Korean memory maker is moving deeper into capacity expansion as Nvidia demand...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
AI demand is turning memory chips into rationed assets, Morgan Stanley says
AI is reshaping the global memory-chip market, according to Morgan Stanley, by pulling in more DRAM, HBM, and NAND, and turning once-cheap components into scarce resources. The shift...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.