National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
Machvision is expanding capacity earlier than planned to meet rising demand from semiconductors, substrates, and optical modules, while tight computer numerical control (CNC) and machining...
General Motors (GM) has started trial runs at a new battery cell line in Warren, Michigan, moving into the validation stage of its next-generation mass production plan. The line at...
Taiwan is moving to align its Green Mark ecolabel with international certification systems in an effort to reduce green trade barriers and shorten time to market for electronics pr...
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV)...
ACM Research (Shanghai)'s order backlog has surged alongside China's semiconductor equipment expansion, giving the Shanghai-listed chip-tool maker a larger base of future deliveries...
Machvision said its "dual-track, four-line" strategy has entered an early growth phase as demand for AI servers, high-speed transmission, and advanced packaging continues to rise....
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
Singapore has launched the SG Semiconductor brand to strengthen its semiconductor profile and attract talent, aiming to create a globally recognizable industry identity beyond its...
Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
One of the most pronounced factors behind China's ferocious rise in the global technology landscape has been its unparalleled strength in the EV sector, where fierce competition over...
