News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Friday 27 March 2026

SK Hynix CEO expected to meet Microsoft executive on memory supply

SK Hynix CEO Kwak Noh-jung is expected to meet Scott Guthrie, executive vice president of Cloud and AI at Microsoft, in Seoul this week...

Friday 27 March 2026

C SUN invests in Contrel, cementing role in G2C+ semiconductor alliance

C SUN and Contrel have announced a significant equity partnership, as C SUN agreed to invest approximately NT$1.02 billion (approx. US$32 million) as a strategic investor to acquire...

Friday 27 March 2026

Taiwan's machine tools upgrade with AI, entering Bombardier supply chain

Taiwan's Industrial Technology Research Institute (ITRI) recently showcased 12 advanced machine tool key technologies driven by artificial intelligence (AI) at the 2026 Taiwan International...

Friday 27 March 2026

Semicon China 2026: AI drives semiconductor market to US$1.8 trillion by 2030, China leads capacity and equipment

AI computing is pushing the semiconductor industry into a structural growth phase, reshaping global capacity and technology pathways, according to Lily Feng, President of SEMI China,...

Friday 27 March 2026

Samsung and SK Hynix expand microscope procurement to boost HBM yield

As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers,...

Friday 27 March 2026

Taiwan-based Keysight launches local manufacturing in India, accelerating global innovation

Keysight Technologies is opening local manufacturing operations in India, a move that promises faster access to precision test equipment and greater supply-chain resilience for global...

Friday 27 March 2026

Micron inaugurates Tongluo site, targets fiscal 2028 DRAM, HBM output

Micron Technology, on March 26, held an inauguration ceremony for its Tongluo site in Miaoli County, marking a milestone following the...

Friday 27 March 2026

UPS and Applied Materials boost Taiwan semiconductor logistics with new Taoyuan hub

Targeting the growing needs of Taiwan's high-tech and semiconductor sectors, UPS has officially launched its Taoyuan International Logistics Center (TILC) with a total investment nearing...

Thursday 26 March 2026

Innos set for late April listing on TPEx, riding advanced packaging boom

Probe card automation equipment maker Innostar Service (Innos) is expected to list on the Taipei Exchange (TPEx) main board in late April 2026. With artificial intelligence (AI) applications...

Thursday 26 March 2026

Universal Microwave Technology ramps up OISL output as LEO delivery deadlines threaten supply chains

SATELLITE 2026, the international satellite industry's premier event, runs from March 23 to 26 in Washington, where Universal Microwave Technology, Inc. will once again engage with...

Thursday 26 March 2026

Hiwin order surge signals industrial recovery amid geopolitical and cost risks

Hiwin Technologies reported stronger-than-expected order momentum, driven largely by demand for semiconductor equipment, artificial intelligence (AI) infrastructure, automation, robotics,...

Thursday 26 March 2026

Kenmec and Meta Green Cooling face public prosecution in Taiwan trade secret case

Automation equipment maker Kenmec Mechanical Engineering and over-the-counter-listed Meta Green Cooling have disclosed that Taipei prosecutors have initiated a public prosecution over...

Thursday 26 March 2026

SEMICON China opens with focus on AI chips and advanced packaging

SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.

Thursday 26 March 2026

China's Naura and AMEC lead China's push into advanced chip packaging

As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.

Thursday 26 March 2026

SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die

SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics'...

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BIZ FOCUS

Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook