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Thursday 2 April 2026
Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning...

Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
Samsung upgrades Austin fab, signals dual-track US chip strategy
Samsung Electronics is accelerating the introduction of next-generation manufacturing equipment at its semiconductor facility in Austin, Texas, as part of a broad upgrade program aimed...
Thursday 2 April 2026
China plans display sector consolidation; panel prices seen stabilizing, equipment orders at risk
China is reportedly drafting a consolidation plan for its display industry, with BOE Technology positioned for small- and mid-sized OLED and TCL China Star (CSOT) for large-size LCD,...
Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...
Wednesday 1 April 2026
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
Wednesday 1 April 2026
Micron reportedly developing stacked GDDR to address shifting AI memory demand

Micron is reportedly developing vertically stacked graphics DRAM (GDDR) products to address shifting AI memory demand, according to...

Wednesday 1 April 2026
ASUS AI Predictive Maintenance Boosts Linyuan Advanced Carbon Black Manufacturing Resilience

Carbon black is a critical functional material underpinning the performance of tires and industrial rubber products. Its production involves a high-intensity, continuous...

Wednesday 1 April 2026
Top 10 Chart: Taiwan's chip toolmakers re-rated as AI bottlenecks trump scale
The first quarter of 2026 has marked a decisive shift in how Taiwan's semiconductor equipment sector is valued. While February's accumulated revenue rankings continue to reflect the...
Tuesday 31 March 2026
MPI probe card lead times stretch to 6 months on AI chip testing surge
Taiwan-based semiconductor testing interface provider MPI Corporation has reported that strong demand from the AI chip testing market has pushed probe card lead times to as long as...
Tuesday 31 March 2026
India approves new electronics component projects to deepen domestic supply chain
India has approved 29 additional proposals under its Electronics Component Manufacturing Scheme (ECMS), as the government steps up efforts to localize the production of critical parts...
Monday 30 March 2026
China's chip equipment and supply chain scale up on AI demand, look overseas
SEMICON China 2026 opened in Shanghai, highlighting how AI demand is reshaping the global semiconductor industry and accelerating China's domestic supply chain.
Monday 30 March 2026
Advantech invests in Intelligent Cloud Plus to strengthen vertical energy software solutions
Industrial PC maker Advantech announced on March 27 a strategic investment via a wholly owned subsidiary in energy solution provider Intelligent Cloud Plus (ICP). The goal: jointly...
Monday 30 March 2026
Sumco shifts wafer strategy to equipment upgrades over new plant
Sumco has revised its semiconductor wafer supply plan to prioritize upgrading existing fabrication equipment over building new capacity, following approval from Japan's Ministry of...
Monday 30 March 2026
Taipower files No. 3 nuclear power plant restart plan, launches safety inspections with Westinghouse
Taiwan Power (Taipower) officially submitted its plan to restart the Maanshan (No. 3) nuclear power plant to Taiwan's Nuclear Safety Commission (NSC) for review on March 27.