Taiwan's National Applied Research Laboratories and semiconductor equipment manufacturer Deuvtek have developed infrared nanosecond laser technology for SiC wafer grinding that cuts...
Taiwan's manufacturing sector experienced significant growth in May and the early part of 2025 despite uncertainties caused by US President Donald Trump's tariff policies. Increased...
Taiwan's government has instructed leading industrial research institutions, such as the Industrial Technology Research Institute (ITRI), the Metal Industries Research and Development...
Samsung Electronics will begin expanding investment in sixth-generation 10nm-class DRAM (1c DRAM) production starting in the second half of 2025. Industry observers interpret this...
Amid the global restructuring of semiconductor supply chains, Chinese investors are intensifying bets on critical upstream technologies. China-based Shanghai Huahong's industrial...
Taiwan saw an impressive surge in exports during the first months of 2025, driven by increased capital expenditures from US cloud service providers and clients advancing order pull-ins...
Adoption of AMOLED panels is expanding beyond smartphones into tablets, notebooks and automotive displays, spurring Chinese and South Korean manufacturers to fast-track investments...
Fresh college graduates in China looking to enter the employment force have their hearts set on major players in the semiconductor industry. However, as they rush to submit resumes,...
The demand for AI remains robust, and visibility is high. Wistron President and CEO Jeff Lin noted that most customers are placing rolling 12-month orders, and current demand is expected...
The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), spearheaded by Intel Corporation in Japan, announced on June 19, 2025, that it has begun...
Niche PCB manufacturer FHt held its annual shareholders meeting, where general manager Taylor Lee highlighted the strong demand for AI server orders from the ASIC sector in 2025....
SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics...
Amid ongoing volatility in the global semiconductor landscape, China's chipmaking equipment sector is undergoing a dual transformation centered on intelligent manufacturing and "re-globalization."...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
LG Display announced a planned investment of approximately KRW1.26 trillion (around US$920 million) to boost its OLED technology capabilities and support its ongoing shift from LCD...
