South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...
Syncmold is moving deeper into the low Earth orbit satellite (LEO) supply chain, aiming to turn nascent demand for ground receivers and satellite components into a larger share of...
Chunghwa Telecom and Nokia signed a memorandum of understanding at the 2026 Mobile World Congress to deepen their strategic collaboration on AI-driven network optimisation, 5G-Advanced...
AblePrint Technology (APT) reported a consolidated revenue of NT$2.302 billion (US$72.4 million) in 2025, up 27.91% year-over-year, driven by robust shipments of pneumatic and thermal...
Facing price competition pressure from China, Taiwan's display panel industry is encountering growing operational challenges. However, the surge in AI chip demand for advanced packaging...
Rapidus will co-develop 2nm image-processing semiconductors with Canon for cameras and surveillance devices, Nikkei reported, and will trial-produce chips at Rapidus's Chitose,...
Taiwan President Ching-te Lai stated on March 2 that one of the government's core policy goals for 2026 is to boost the economy by fully promoting the country's AI major infrastructure...
Hiwin Technologies has spent more than a decade building direct manufacturing and service capacity in South Korea, evolving from component sales to integrated mechatronic solutions...
TSMC is accelerating supplier upgrades and has made growing the share of Taiwan-sourced equipment components a long-term strategic objective. As of February 2026, it had worked with...
Japan is planting its flag in India's semiconductor sector — and doing so fast. The market is projected to reach US$110 billion by 2030, and Japanese firms are racing to claim...
As generative AI drives rapid expansion in data centers and high-performance computing (HPC) infrastructure, the importance of interconnect technology is evolving from traditional...
Given the steady demand for AI and high-performance computing (HPC) chips, Unimicron stated that orders for IC substrates and PCBs have picked up. This has not only steadily increased...
Taiwan's IC packaging and testing supply chain is accelerating expansion as Sigurd announced it will invest NT$1.54 billion (approx. US$49M) to purchase a factory in the Hukou Industrial...
