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Thursday 30 July 2026
China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
Thursday 30 July 2026
Advantest lifts fiscal 2026 forecast as AI chip test demand surges

Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

Thursday 30 July 2026
Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating...
Thursday 30 July 2026
US FCC curbs Chinese inverters and robots, accelerating global shift in connected device security
As power grids, renewable energy systems, and artificial intelligence data centers expand, a new US restriction on Chinese-made inverters and robots could affect suppliers, utilities,...
Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
US blocks new foreign-made robots and power inverters in AI security crackdown

The US has barred new foreign-produced advanced robots and power inverters from receiving regulatory approval, extending its technology...

Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
Wednesday 29 July 2026
ASM raises 2027 revenue outlook as AI-driven chip demand lifts forecast

On July 28, ASM International raised its revenue outlook for 2027 and issued third-quarter guidance above market expectations after...

Wednesday 29 July 2026
Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion...
Wednesday 29 July 2026
KLA raises wafer equipment market outlook as AI investment drives record quarterly revenue

KLA raised its outlook for the global wafer equipment market and forecast record revenue for the current quarter after reporting better-than-guidance...

Wednesday 29 July 2026
Commentary: Why China's 2026 tech breakthroughs are a generational harvest

Judging only by the news of summer 2026, China's technology sector appears to have entered an unusually concentrated period of brea...