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Tuesday 14 April 2026
Samsung begins P4 equipment orders as 1c DRAM investment enters execution

Samsung Electronics has begun procuring semiconductor equipment for its P4 facility in Pyeongtaek, marking the transition of its planned...

Tuesday 14 April 2026
Samsung Electro-Mechanics reportedly to expand AI packaging with MLCC embedded substrate line in Vietnam
As AI chips demand higher performance and denser integration, advanced packaging and substrate technologies have become critical in the semiconductor race. Samsung Electro-Mechanics...
Tuesday 14 April 2026
King Yuan Electronics posts record 1Q26 revenue, raises capex to NT$50 billion
Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing...
Tuesday 14 April 2026
Yaskawa Electric sees AI robot, chip demand boost profits

Japan's Yaskawa Electric is pointing to a turning point in its earnings trajectory, with AI-driven robotics and semiconductor equipment...

Monday 13 April 2026
Global chip equipment sales reach record US$135 billion as AI drives investment surge

Worldwide semiconductor manufacturing equipment sales rose 15% to a record US$135.1 billion in 2025 from US$117.1 billion a year earlier,...

Monday 13 April 2026
Global chip sales expect to top US$1 trillion in 2026 on AI demand

Taiwan's semiconductor supply chain posted stronger-than-expected results in the first quarter of 2026, as artificial intelligence (AI)...

Monday 13 April 2026
Aurotek posts record 1Q26 revenue on AI software, robotics integration
Aurotek reported record-high revenues in March and the first quarter of 2026, driven by a surge in market demand for its robotics products integrated with artificial intelligence (AI)...
Monday 13 April 2026
DIGITIMES Insight: US MATCH Act tightens export noose while Intel swaps debt for control and Nvidia co-opts rivals
The semiconductor industry is undergoing coordinated shifts that could reshape equipment flows, corporate financing, and supplier relationships in the AI era, according to DIGITIMES...
Monday 13 April 2026
Taiwan's chip program covers 200+ high-end devices to boost advanced IC design talent
The Chip-based Industrial Innovation Program (Taiwan CBI), a decade-long, NT$300 billion (US$9.4 billion) initiative launched by the Executive Yuan to support academic and research...
Sunday 12 April 2026
US expands tech curbs on China with MATCH Act and FCC testing ban proposal

US lawmakers from both parties have recently introduced a new bill aimed at further restricting China's access to advanced semiconductor...

Sunday 12 April 2026
China's Hwatsing ships 1,000th CMP system, targets advanced chip manufacturing growth

Hwatsing Technology has emerged as one of China's most prominent domestic suppliers of chemical mechanical planarization (CMP) equipment,...

Friday 10 April 2026
Eclat Forever Machinery secures large IC substrate orders with visibility to 2027
High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
Friday 10 April 2026
SK Hynix M15X reportedly ramps early production
SK Hynix's M15X is widely viewed as the company's next-generation DRAM manufacturing hub in Cheongju, South Korea. Designed primarily to support high-bandwidth memory (HBM) output...
Friday 10 April 2026
Merck's material and equipment push could speed CPO and advanced packaging adoption
Merck presented integrated materials and inspection tools at Touch Taiwan 2026 as the panel industry pivots toward chip-on-panel (CPO) and advanced packaging. The company emphasized...
Friday 10 April 2026
MPI posts record 1Q26 revenue, invests NT$2B in Hsinchu plant expansion
Semiconductor test interface leader MPI reported a new quarterly revenue high in the first quarter of 2026, driven by strong demand for AI-related chip testing and signaling sustained...