News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Friday 4 September 2026

Kyocera completes Nagasaki plant for semiconductor ceramics and packages

Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...

Friday 4 September 2026

China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls

China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...

Friday 4 September 2026

Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications

Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...

Friday 4 September 2026

Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins

Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...

Friday 4 September 2026

Processor, memory boom could push chip supply chain out of sync, says Yole

Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...

Friday 4 September 2026

Silicon photonics testing shift could reshape how CPO suppliers win business

As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...

Thursday 3 September 2026

Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty

Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense...

Thursday 3 September 2026

China chip tool makers expand beyond import substitution at CSEAC 2026

China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

Thursday 3 September 2026

Niching validates 500-ton press for large heat spreaders

Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...

Thursday 3 September 2026

Semiconductor sustainability shifts to cost control as fab resource demand surges

Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

Thursday 3 September 2026

Taiwan LED packaging provider Ligitek pivots to silicon photonics; 1.6T modules eye 2H27 revenue

Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production...

Thursday 3 September 2026

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...

Thursday 3 September 2026

Solomon leverages AI vision and optical tech to tap semiconductor inspection market

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies...

Thursday 3 September 2026

TSMC doubles down on equipment purchase as AI demand is outpacing semiconductor supply chain planning

TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...

Thursday 3 September 2026

AUO unit eyes TSMC ecosystem as merger benefits emerge

AUO Group's AET Corporation (AET), formed in September 2025 through the merger of AUO Envirotech and AUO Digitech, is expanding across the semiconductor supply chain and has reportedly...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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