Nanya, ITRI team up for 3D stacked DRAM

Josephine Lien, Taipei; Jessie Shen, DIGITIMES Asia Tuesday 25 January 2011 0

Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity DRAM products, according to Nanya.

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