Unimicron to spend NT$6-7 billion for capacity ramp in 2011

Olivia Hu, Taipei; Steve Shen, DIGITIMES Asia Monday 31 January 2011 0

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet increasing demand from the smartphone and tablet PC sectors, according...

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS