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Unimicron to spend NT$6-7 billion for capacity ramp in 2011

Olivia Hu, Taipei; Steve Shen, DIGITIMES Asia Monday 31 January 2011 0

Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet increasing demand from the smartphone and tablet PC sectors, according...

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