Unimicron Technology's IC substrate plant in Taoyuan, northern Taiwan caught fire on the afternoon of October 28. The site is where the company produces flip-chip chip-scale packaging...
Genesis Photonics has been making efforts to promote FC CSP (flip chip chip scale packaging) for automotive headlights in a bid to bounce back from eight consecutive quarters of net...
Taiwan-based IC substrate maker Kinsus Interconnect Technology, which saw its sales hit a record high in 2014, is expected to report a more than 5% sales increase for 2015, according...
Taiwan-based IC substrate makers Unimicron Technology, Kinsus Interconnect Technology and Nanya PCB will continue to ramp up their production capacities for flip-chip chip scale package...
The board of directors of Unimicron Technology, a manufacturer of PCBs and IC substrates, has approved plans to budget NT$10.67 billion (US$335.5 million) in capex for 2015.
IC packaging material and tool distributor Niching Industrial looks to ramp up its shipments of EMC-based (epoxy molding compound) LED leadframes and FC CSP substrates to drive revenue...
Siliconware Precision Industries (SPIL), in view of fast growing demand for ICs used in smartphones, is setting up FC (flip chip) CSP (chip scale package) capacity at its two factories...
IC backend house Siliconware Precision Industries (SPIL) has forecast consolidated revenues for the the first quarter of 2014 will decrease 4-8% sequentially, as production utilization...
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...
Kinsus Interconnect Technology is expected to see its revenues drop 5% sequentially in the fourth quarter of 2013 as declining demand from the high-end smartphone sector will offset...
Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to secure backend orders for fingerprint sensors, application processors and Wi-Fi modules for...
IC substrate supplier Kinsus Interconnect Technology is expected to see its third-quarter revenues climb to an all-time high with gross margin rising above 27%, thanks to growing...
