Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...
Kinsus Interconnect Technology will perform relatively strongly in the first quarter of 2013, buoyed by shipments of FC CSP (flip-chip chip-scale package) substrates to clients including...
STATS ChipPAC has announced plans to expand its semiconductor assembly and test operation in South Korea. The Singapore-based backend house added that it has signed a non-binding...
The supply of a chemical raw materials for producing ink used in the production of FC CSP (flip chip-chip scale package) substrates may be affected after a recent explosion and fire...
Kinsus Interconnect Technology has entered the supply chain of Apple's iPhone 5 and is expected to see robust shipments of its FC CSP (chip scale package) substrates for Qualcomm's...
IC substrate supplier Kinsus Interconnect Technology has announced NT$2.8 billion (US$94.9 million) in net profits and an EPS of NT$6.28 for 2011. The firm's board of directors decided...
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Shipments of flip-chip chip-scale package (FC CSP) substrates for Apple's A5 processors from Taiwan-based Kinsus Interconnect Technology are expected to top one million units a month...
Unimicron Technology will soon begin to ship its FC CSP (flip-chip chip-scale-packaging) substrates to Texas Instruments (TI) for the production of ARM-based OMAP3 CPU lineups, according...
IC substrate maker Kinsus Interconnect Technology has announced revenues of NT$1.48 billion (US$50.95 million) for July, up 5.5% sequentially and 8.3% on year, according to a company...
IC substrate maker Kinsus Interconnect Technology has reported net profits of NT$1.41 billion (US$48.91 million) for the first half of 2011, which translated into an EPS of NT$3.16...
Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...
IC substrate maker Kinsus Interconnect Technology has landed orders for FC CSP (flip-chip chip-scale packaging) substrates from Intel, according to a Chinese-language Commercial...
