Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

Mavis Hong, Taipei; Jessie Shen, DIGITIMES Asia Thursday 2 May 2013 0

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL might consider raising its full-year capex budget to add capacity to...

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