High-end IC backend demand to pick up in 2H13, says SPIL chair

Mavis Hong, Taipei

Jun 14, 2013, 16:09 0

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in of orders ahead of vendors launching their new flagship smartphones and games...

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