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China-based foundry house XMC ties up with Spansion to develop 3D NAND flash chips

Josephine Lien, Taipei; Steve Shen, DIGITIMES Asia Wednesday 1 October 2014 0

China-based 12-inch wafer foundry house XMC reportedly has teamed up with Spansion to jointly develop and produce 3D NAND flash chips, with trial production to begin in 2016 and volume production in 2017, according to industry sources.

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