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Samsung developing FOPLP for wearable devices

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Monday 29 October 2018 0

Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application processors (AP) for use in wearable devices since 2018, according to...

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