Components suppliers are naturally eyeing the business opportunities arising from 5G developments, with heat-sink solution providers expecting VC-based cooling solutions to become a mainstream for smartphones in 2020. For PCB makers, momentum from the smartphone sector is picking up faster than that for the base station sector where deployments in China has been dented by the US-China trade war.
Heat-sink solution providers to brace for strong sales along with 5G deployments: The development of 5G networks including infrastructures, edging computers and end-market devices will significantly scale up global demand for heat-sink solutions in 2020 and beyond, according to industry sources.
PCB makers see stronger momentum from 5G smartphones than base stations: For PCB makers, especially those based in Taiwan, 5G business opportunities from smartphones may outrace those from base stations as demand for the latter has been dented by slowed construction of the stations in China, according to industry sources.