UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through the wholly-owned Japanese subsidiary, now renamed United Semiconductor Japan (USJC), the Taiwan-based foundry house reportedly has entered the supply chain for Sony's CMOS image sensors. CIS demand is expected to see impressive growth coming from the automotive sector and 5G phone market. Taiwanese IC design houses have already seen significant increases in orders from 5G phone vendors, particularly those from China. Orders from Chinese handset vendors have also been buoying sales at PCB maker Tripod Technology, who is set to report record sales for 2019. Chinese handset vendors have also turmed keen on introducing foldable devices next year. China-based panel maker Tianma Microelectronics, eyeing opportunities from such a trend, has decided to devote more of its production capacity to making flexible AMOLED applications.
UMC enters supply chain for Sony CIS: United Microelectronics (UMC), through its takeover of Mie Fujitsu Semiconductor (MIFS), has entered the supply chain for Sony's CMOS image sensors, according to industry sources.
Taiwan IC design houses see increases in orders for 5G phones: Taiwan-based IC design houses have seen significant increases in orders for related ICs for 5G phones recently, particularly from first-tier Chinese handset brands, with the ramp-ups likely to result in strong performances for most firms in the first quarter of 2020, according to sources from Taiwan's IC supply chain.
PCB maker Tripod on track to end 2019 with record revenues: HDI PCB specialist Tripod Technology is on track to meet its revenue target of NT$54 billion (US$1.77 billion) for 2019, a new high compared to the previous record of NT$52.1 billion in 2018, as its shipments of anylayer HDI boards to Chinese handset vendors have remained robust in the fourth quarter, traditionally an off season, according to industry sources.
Tianma ramping up flexible AMOLED panel capacity: China-based flat panel maker Tianma Microelectronics plans to convert its rigid AMOLED panel product lines at its 6G line in Wuhan to the production of flexible applications, with the conversion to be completed in the first half of 2020, according to industry sources.