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Chips R&D matters: Q&A with iST chairman Danny Yu

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Tuesday 8 September 2020 0

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects on sophisticated and high performance computing (HPC) chips for 5G and...

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