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C Sun expects advanced IC packaging equipment to drive growth

Jane Wang, Taipei; Adam Hwang, DIGITIMES Asia Friday 27 November 2020 0

Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate), to be the major source of business growth in 2021.

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