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Backend firms gearing up to embrace chip demand boom for 5G Android phones

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0

Credit: DIGITIMES

OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured in the upcoming Android models slated for launch in the first quarter...

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