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TSMC advanced packaging enters next phase of development, says company VP

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 1 December 2021 0

TSMC reports progress in packaging tech. Credit: DIGITIMES

TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according to Douglas Yu, company VP of Pathfinding for System Integration.

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