中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
Aerospace
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Intel
Nvidia
Meet the Analysts
Server EMS Tracker
Robotics Report
AI Server Report
SCMP Bundle
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
HTC aims to strengthen global AI glasses position
Tomorrow's Headlines
Sep 23, 18:49
Huawei's HBM market push with customized products puts Samsung and SK Hynix on alert
Tomorrow's Headlines
Sep 23, 18:49
South Korea urges US visa fee discounts amid H-1B cost hike impact
Tomorrow's Headlines
Sep 23, 18:49
YMTC advances 267-layer NAND production with hybrid bonding, targets over 300 layers
Tomorrow's Headlines
Sep 23, 18:48
Nvidia and Intel form strategic partnership to integrate x86 with GPU for AI growth
Tomorrow's Headlines
Sep 23, 18:48
Nvidia advances SOCAMM2 standard as Longsys follows in AI memory market
Tomorrow's Headlines
Sep 23, 18:48
Home
Research
Research insights
Denso deepens deployments for third-gen semiconductors; Foxconn partners with Vedanta; XPeng expands presence in Europe
Tom Lo, DIGITIMES Research, Taipei
Tuesday 22 February 2022
0
The Research analysis you are trying to open requires subscription to any of the DIGITIMES Research services. Please
sign in
if you wish to continue.
Introduction
Related story
Denso launches new RC-IGBT for EV, reducing energy loss by 20%
Tags
Asia enterprises
automotive
Denso
Digitimes Research
Europe
Foxconn
India
Japan
TSMC
Vedanta
Companies
Foxconn Electronics (Hon Hai Precision Industry)
Taiwan Semiconductor Manufacturing Company
Share this article
Other links
Print
BIZ FOCUS
Sep 9, 12:48
Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
Tuesday 23 September 2025
Smiths Interconnect announces significant contract win with AMD
Tuesday 23 September 2025
Quantum resilience: Quantum cryptography will protect the future of the global network equipment supply chain
Tuesday 23 September 2025
Henkel Adhesives highlights portfolio of Semiconductor Packaging Materials to foster collaboration with Taiwan
MOST-READ
7 DAYS NEWS
Samsung-Nvidia CEO embrace hints at HBM4 deal amid Seoul's U$150B US pledge
Exclusive: Micron halts NAND and DRAM quotes after SanDisk price hike, sharper increases looming
TSMC to raise foundry prices by 5-10% across advanced nodes in 2026
CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
Memory prices surged in 4Q25, defying seasonal trends as AI drives demand
Why Intel's US$16 billion lifeline won't solve its foundry crisis?
MediaTek in talks with TSMC on Arizona production, rolls out new Dimensity 9500
China unveils grand plans for AI independence amid tech war
Hyundai expands demand responsive transit services to address mobility gaps
Foxconn pushes UK design, Taiwan manufacturing for space industry growth
Full list
Join our mailing list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first