TSMC to build new CoWoS capacity in central Taiwan

, Hsinchu

Jun 26, 2023, 14:46 0

Credit: DIGITIMES

TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand for AI GPU and other HPC (high performance computing) chips, driven by the...

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