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Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC

Amy Fan

Amy Fan

, Taipei, DIGITIMES Asia

Apr 8, 2024, 14:29 0

Credit: AFP

Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging (I-Cube) solutions. Regarding industry speculation, Samsung has stated...

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