Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies.
This expansion follows Samsung's 2023 decision to establish the Advanced Packaging Laboratory (APL) in Yokohama's Minato Mirai 21 district. The facility, occupying roughly 2,000 tsubo (6,600 square meters), will house over 100 R&D personnel to enhance semiconductor packaging technology, with operations slated to begin in 2025.
The recent personnel increase includes staff from construction operations, human resources, finance, and Samsung's Advanced Packaging (AVP) business unit, highlighting Samsung's efforts to accelerate APL's advancement and solidify its position in the competitive semiconductor packaging landscape.
The APL will involve a total investment of JPY40 billion (US$260 million). Notably, the Japanese government has announced that it will provide a subsidy of JPY 200 billion, covering half of the total investment. The subsidy will be sourced from Japan's "Post-5G Fund," dedicated to supporting the development of semiconductors in the country.
According to industry analysts, Samsung's choice of Yokohama as the location for its advanced packaging R&D base is primarily due to the city clustering of many packaging-related companies and boasting an outstanding talent pool from its renowned universities.
It is reported that Samsung plans to focus R&D on AI and 5G semiconductor back-end process technologies at APL, which may also be applied to the sixth-generation High-Bandwidth Memory (HBM), HBM4.
This focus aligns with Japan's strong prowess in back-end processes demonstrated by renowned players such as Ibiden, Shinko Electric, Resonac, and Ajinomoto Fine-Techno.
South Korean industry observers believe that as chip packaging technology continues to gain importance, cooperation with Japan is crucial for Samsung to enhance its packaging capabilities and narrow the gap with TSMC.
