The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Taiwan's export surge is increasingly tied to high-value AI servers and pricier memory chips, a shift with implications far beyond the island. As exports climb, the outlook underscores...
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...
Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions...
Taiwan-based server management chip supplier Aspeed Technology reported consolidated revenue of NT$1.636 billion (approx. US$51.16 million) for September 2026, up 100.93% year-over-year...
Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company...
Hermes Testing Solutions (HTSI) reported September revenue of NT$514 million (US$16.10 million), up 2.35% month over month and 150.33% year over year, as shipments of customized products,...
Novatek reported stronger September and third-quarter 2026 revenue, suggesting seasonal smartphone demand and growth in edge AI chips are supporting the global display and chip supply...
Huawei consumer business group chairman Richard Yu said surging memory component costs have added more than US$200 to the hardware cost of each Huawei smartphone, putting fresh pressure...
Samsung Electro-Mechanics (Semco) has reportedly completed initial reliability testing of its 100mm glass substrates and moved to package-level verification using customer chips, marking...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
SpaceX is reportedly seeking US$40 billion in financing to purchase Nvidia chips, a massive capital commitment driven by surging artificial intelligence (AI) computing demand. Viewed...
