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    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    4min ago
    BIS blocks Polestar authorization, forcing new vehicles out of US market from 2027
    15min ago
    Global semiconductor revenue hits record US$425B in 2Q26
    20min ago
    Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028
    26min ago
    GlobalWafers partially resumes Italy plant, restarts EPI production
    33min ago
    China's space-computing race moves beyond single satellites: Shanghai's gigawatt-scale AI ambition lands in orbit
    44min ago
    NEWS TAGGED CHIPS
    Tuesday 15 September 2026
    Column: When digital trust breaks — quantum risk rewrites supply chain resilience
    Supply chain resilience was once centred on raw materials, components, factories and logistics. AI, cloud services and the digital economy have expanded the risk perimeter. Companies...
    Tuesday 15 September 2026
    Chinese tech firms deepen open source push amid AI pacing debate

    As US AI executives warn that artificial intelligence development may need to slow down, Chinese companies are pressing ahead with open...

    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
    Tuesday 15 September 2026
    Nvidia, MediaTek deepen 20-year chip ties

    Nvidia and MediaTek have recently drawn market attention after Nvidia invested US$3.5 billion in MediaTek convertible bonds, expanding...

    Tuesday 15 September 2026
    Commentary: CIOE 2026 reveals the harder race behind AI optical interconnects

    The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor,...

    Tuesday 15 September 2026
    The 1,000-watt problem: a TSMC veteran on the brute force forging Nvidia's AI chips
    "He practically created a new era—the age of AI," Mou-Shiung Lin said of Nvidia CEO Jensen Huang. Yet, the early TSMC executive describes the methodology behind that success...
    Monday 14 September 2026
    DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
    ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
    Monday 14 September 2026
    China accelerates e-SIM's leap from wearables to smartphones
    China's e-SIM adoption is moving beyond smartwatches and other wearables into smartphones at an accelerating pace.
    Monday 14 September 2026
    AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
    Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
    Saturday 12 September 2026
    Murata targets mass production of its AI power substrate next year
    Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest...
    Friday 11 September 2026
    Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
    Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
    Friday 11 September 2026
    CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
    Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from...
    Friday 11 September 2026
    AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
    Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
    Friday 11 September 2026
    Apple makes the hinge, not the screen, the centerpiece of its first foldable
    Apple has built its first foldable around a component nobody sees. The iPhone Duo, unveiled 9 September and on sale from 23 October at a starting price of US$1,999, is defined less...
    Friday 11 September 2026
    Taiwan startup taps CMOS infrared chips to give robots an electronic 'nose'

    Breaking from the industry's mainstream reliance on III-V compound semiconductors, Taiwanese startup Taiwan Nano & Micro-Photonics...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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