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    G20 approves guidelines calling for more business-friendly AI regulation
    22min ago
    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    Sep 3, 18:26
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    Sep 3, 18:26
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    Sep 3, 18:26
    NEWS TAGGED CHIPS
    Friday 4 September 2026
    Analysts read Nvidia's Hugging Face deal as a hedge, not a software bet
    Nvidia's agreement to buy Hugging Face for roughly US$13 billion is being framed by analysts less as a move into software than as insurance against three ways its core business could...
    Friday 4 September 2026
    Taiwan's tech council allocates NT$3.76 billion for quantum host
    Taiwan's National Science and Technology Council (NSTC) has budgeted NT$3.76 billion (US$116.58 million) for a quantum computer system project, while the Industrial Technology Research...
    Thursday 3 September 2026
    CHPT spans wafer to system-level testing
    Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
    Thursday 3 September 2026
    Niching validates 500-ton press for large heat spreaders
    Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
    Thursday 3 September 2026
    Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
    Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
    Thursday 3 September 2026
    Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
    For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
    Thursday 3 September 2026
    China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
    Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...
    Thursday 3 September 2026
    TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling
    As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
    Thursday 3 September 2026
    CPO material race widens as Taiwan eyes key role
    At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...
    Wednesday 2 September 2026
    TCL CSOT bets on InP laser chips as supply tightens
    Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
    Wednesday 2 September 2026
    AI demand push expands wafer industry's growth outlook
    AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

    Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

    Wednesday 2 September 2026
    Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

    Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

    Tuesday 1 September 2026
    Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables
    DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...
    Tuesday 1 September 2026
    Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs
    Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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