News tagged chips at DIGITIMES

NEWS TAGGED CHIPS

Thursday 3 September 2026

Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...

Thursday 3 September 2026

Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips

For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...

Thursday 3 September 2026

China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration

Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser...

Thursday 3 September 2026

TRUMPF targets advanced packaging as AI chip makers chase higher density and better cooling

As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...

Thursday 3 September 2026

CPO material race widens as Taiwan eyes key role

At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...

Wednesday 2 September 2026

TCL CSOT bets on InP laser chips as supply tightens

Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...

Wednesday 2 September 2026

AI demand push expands wafer industry's growth outlook

AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...

Wednesday 2 September 2026

Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

Wednesday 2 September 2026

Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As...

Tuesday 1 September 2026

Research insights: AI Fabric optical interconnects move into racks as 400G/lane and CPO maturity emerge as key variables

DIGITIMES observed that as AI systems continued to scale, interconnect requirements inside AI data centers had expanded from chips, packages, and boards to racks, clusters, and eventually...

Tuesday 1 September 2026

Z.ai runs GLM inference on 100,000 Chinese AI chips, eyes overseas CSPs

Chinese large-model developer Z.ai says it can now support large-scale inference using roughly 100,000 domestically produced AI chips, while its GLM models are also moving closer to...

Tuesday 1 September 2026

Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers

Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...

Tuesday 1 September 2026

Huawei's revenue climbs 9.6%, but AI, chips and HarmonyOS exact heavier R&D toll

Huawei Technologies increased first-half revenue in 2026 while profit fell sharply, highlighting the growing cost of its effort to build a self-sufficient technology stack spanning...

Tuesday 1 September 2026

India expands chip ambitions with full Semicon 2.0 notification

India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...

Tuesday 1 September 2026

Taiwan's G2C+ Alliance members target global markets

Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...

1/94 pages

BIZ FOCUS

Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

MOST-READ
7 DAYS NEWS

Full list