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NEWS TAGGED CHIPS
Monday 24 August 2026
MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...
Monday 24 August 2026
Jeilin shifts upmarket as high-end image SoCs drive margins higher
Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...
Monday 24 August 2026
Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
Monday 24 August 2026
iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Friday 21 August 2026
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
Friday 21 August 2026
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced...
Thursday 20 August 2026
Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
Marvell Technology is set to deepen its role in Google's AI infrastructure through an expanded agreement to develop custom chips, in a deal that could generate roughly US$120 billion...