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Friday 21 August 2026
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
Friday 21 August 2026
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

Friday 21 August 2026
Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026
Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced...
Thursday 20 August 2026
Analysis: Marvell's US$120bn Google deal is the AI chip industry's new playbook — equity for orders, not cash
Marvell Technology is set to deepen its role in Google's AI infrastructure through an expanded agreement to develop custom chips, in a deal that could generate roughly US$120 billion...
Thursday 20 August 2026
Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment...
Thursday 20 August 2026
Samsung repays 20 trillion won SDC loan early as memory demand surges

Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026,...

Thursday 20 August 2026
India's chipmaking push faces its real test after initial wafers: yield
India's semiconductor manufacturing drive will face one of its toughest tests after equipment is installed and production begins: whether new fabs can consistently produce enough working...
Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

Wednesday 19 August 2026
Nvidia H200 chips reach China as imports remain limited
ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...
Wednesday 19 August 2026
Commentary: Tsinghua Unigroup distances itself from failed US$15 billion Dongguan chip-cloud project

Tsinghua Unigroup's former "chip-to-cloud" expansion strategy unraveled after a debt crisis in 2020 and subsequent bankruptcy restructuring...