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NEWS TAGGED CHIPS
Tuesday 22 September 2026
Anthropic, OpenAI expected to start buying memory directly in 2027
Anthropic and OpenAI are expected to start buying memory directly from manufacturers in 2027 as model developers take greater control of chip and data-center design, potentially broadening...
Tuesday 22 September 2026
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the...

Tuesday 22 September 2026
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group...
Tuesday 22 September 2026
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...
Tuesday 22 September 2026
Apple's reported AI server push could reshape its role in enterprise infrastructure

Apple is reportedly developing an enterprise AI inference server powered by its in-house M8 Ultra chips. This move could mark its return...

Tuesday 22 September 2026
MediaTek launches Dimensity CX brand for laptops, starting with a 3nm chip for Googlebook
MediaTek has launched the Dimensity CX C10 Max, the first chip in a new family called Dimensity Compute Experiences (CX), and is aiming it at Googlebook laptops.
Monday 21 September 2026
Leading Interconnect Semiconductor starts Shenzhen advanced packaging substrate plant

Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project...

Monday 21 September 2026
Apple, Xiaomi, Qualcomm each eye edge AI ecosystem gains
Market sources say Apple is developing an enterprise AI server that could use 2-4 unreleased M8 Ultra processors, aimed at AI developers, large enterprises and government agencies...
Monday 21 September 2026
ByteDance's China AI chip push hits substrate shortage

China's fast-rising AI models are running into a compute supply bottleneck as demand for advanced packaging substrates surges, with...

Monday 21 September 2026
DIGITIMES Insight: AI chip upgrades shift substrate supply bottleneck from upstream materials to equipment
DIGITIMES Intelligence has observed that as the performance of AI accelerators and server CPUs continues to advance, chips are increasing not only in compute core counts and...
Sunday 20 September 2026
Charts: Two-thirds of Taiwan's chip equipment growth comes from testing AI chips

Taiwan's listed semiconductor equipment, components, and solutions suppliers are growing at nearly twice the pace of the chipmakers...

Saturday 19 September 2026
Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged...

Friday 18 September 2026
China's AI data center token costs hinge on access to advanced GPUs
China's AI data centers are confronting a severe chip access bottleneck, with the cost of producing tokens shaped less by model design than by geopolitics, according to a recent Caijing...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
China sees a second chance in VLEO as AI shifts the satellite race from chips to networks
Starlink's massive scale in conventional low-Earth-orbit (LEO) satellites has markedly reinforced the satellite giant's aggressive grip on the commercial space industry for the next...