Mobileye, the Israeli autonomous driving technology company, said on January 5, 2026, that it had reached a partnership with a US automaker ranked among the world's top 10 to integrate...
At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
TCL's marketing of its entry-level RGB Mini LED television has come under closer industry scrutiny after market research firm Omdia said the product does not fully adopt the RGB backlight...
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production...
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...
Taiwanese networking companies are broadly optimistic about returning to growth in 2026 as an AI-driven expansion moves beyond chips and servers into network transmission layers, and...
Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters...
Chinese semiconductor companies are returning to the initial public offering (IPO, including additional and rights offering) market in force, raising funds that are critical for the...
