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Thursday 30 October 2025
JCET unveils Singapore blueprint for next-gen semiconductor packaging
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
Thursday 30 October 2025
Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day
Taiwanese semiconductor group Egis Technology held its annual "2025 Egis Tech Day" on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of "fully activated...
Thursday 30 October 2025
Nexperia's export ban sparks Brazil auto shutdown fears
Brazil's government has warned of an impending semiconductor shortage that could halt car production within weeks, the latest fallout from the Dutch government's takeover of Chinese-owned...
Wednesday 29 October 2025
Apple and Tesla orders fuel Samsung's recovery
Apple's mobile DRAM orders are expected to increase significantly in 2026, and the South Korean industry predicts that Samsung Electronics will be the largest beneficiary. News...
Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 29 October 2025
Commentary: With new AI chips, Qualcomm joins race to challenge Nvidia in the cloud

Qualcomm on Tuesday unveiled its latest AI accelerator cards, the AI200 and AI250, along with corresponding rack-level system designs,...

Tuesday 28 October 2025
Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26
Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
Tuesday 28 October 2025
TSMC breaks ground on second Kumamoto chip plant, expanding Japan footprint

TSMC's Japanese subsidiary, Japan Advanced Semiconductor Manufacturing (JASM), officially signed an agreement with the local government...

Monday 27 October 2025
Taiwan’s PCB makers enter ‘AI moment’ as complexity nears semiconductor levels
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles...
Monday 27 October 2025
Nexperia dispute threatens legacy chips critical to basic car functions for automakers worldwide
The largest US auto-parts trade group has warned that domestic carmakers may see major production disruptions within two to four weeks, as the escalating dispute over Nexperia risks...
Monday 27 October 2025
Weekly news roundup: TSMC tightens China orders; Micron sees DRAM market tightening; CXMT, Huawei advance HBM3 chips
Below are the top DIGITIMES Asia stories from October 20 to 26, 2025.
Monday 27 October 2025
Etron's Nicky Lu sees DRAM rally lasting six months, bets on a strong 2026
The memory industry has recently become a hot topic, with Etron chairman Nicky Lu stating that the current AI boom will drive continuous growth in the semiconductor sector over the...
Monday 27 October 2025
Tesla’s next AI chip taps both TSMC Arizona and Samsung Texas fabs

At its third-quarter 2025 earnings call, Elon Musk revealed a major "Made in America" development: Tesla's next-generation AI chip, AI5,...

Thursday 23 October 2025
AIC to supply AMD's wider Helios AI server cabinets starting 2Q26
AIC and AMD are launching the MI450 series Helios AI server cabinets in the second quarter of 2026, enhancing component placement and supported by partnerships with major tech firm...
Thursday 23 October 2025
Nexperia crisis threatens disruption to EU and US auto production
The unfolding crisis at Dutch chipmaker Nexperia, a subsidiary of China's Wingtech Technology, is rapidly escalating from a regulatory dispute into a transatlantic warning for the...