中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED CHIPS
    Wednesday 11 March 2026
    JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

    JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

    Wednesday 11 March 2026
    Applied Materials partners with Micron, SK Hynix on US$5B AI memory R&D hub

    Applied Materials has partnered with memory chipmakers Micron Technology and SK Hynix to develop next-generation memory technologies for...

    Tuesday 10 March 2026
    TSMC February 2026 revenue climb on AI demand despite seasonal dip
    TSMC reported February 2026 revenue of NT$317.66 billion (US$10 billion), up 22.2% year over year but down 20.8% month over month from January's NT$401.26 billion, according to the...
    Tuesday 10 March 2026
    Iran conflict threatens Gulf data center boom as attacks mount
    The widening conflict involving Iran is beginning to ripple through the global AI industry, raising new questions about the security of Gulf-backed data center projects and the resilience...
    Tuesday 10 March 2026
    Groq reportedly urges Samsung to expand wafer production as AI chip demand surges
    Groq has reportedly requested Samsung Electronics' foundry division to increase wafer production for its inference AI chips, reflecting the booming market demand. Industry sources...
    Tuesday 10 March 2026
    Japan targets JPY40 trillion in domestic semiconductor sales by 2040
    Japan plans to boost domestic semiconductor sales to JPY40 trillion (approx. US$253.5 billion) by 2040, a sharp increase from current levels, as the government intensifies efforts...
    Monday 9 March 2026
    China warns Nexperia dispute could trigger new global chip shortage
    China's commerce ministry has warned that the conflict between Dutch chipmaker Nexperia and its Chinese subsidiary could trigger another global semiconductor supply chain crisis, raising...
    Monday 9 March 2026
    Industry mulls thicker HBM standards for 20-layer stacks
    Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
    Monday 9 March 2026
    US weighs global AI chip export licensing to curb third-country diversion
    The White House is reportedly drafting a new regulatory framework that would tighten US oversight of global AI chip exports. This move could reshape how advanced computing power is...
    Monday 9 March 2026
    Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

    Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity...

    Monday 9 March 2026
    OpenAI, Oracle rethink Texas expansion, though Stargate buildout continues
    OpenAI and Oracle's decision to drop a planned expansion at their flagship Texas AI campus highlights the shifting economics and technology cycles of large-scale AI infrastructure...
    Sunday 8 March 2026
    Applied Materials VP warns AI growth may hit energy, not chip limits
    AI is rapidly driving global computing demand and accelerating semiconductor industry growth. Applied Materials vice president Erix Yu expects the semiconductor market to reach US$1...
    Sunday 8 March 2026
    Defense chips, satellite systems now "100% localized," Chinese academics say

    As conflict in the Middle East intensifies and geopolitical risks rise, governments worldwide are paying closer attention to the resilience...

    Friday 6 March 2026
    Nvidia's LPU push could reshape inference economics as OpenAI signals major buy
    Nvidia plans to shift the AI compute battleground from training to inference by integrating language processing unit technology and offering multiple inference chips, with OpenAI agreeing...
    Friday 6 March 2026
    Intel’s EMIB gains traction as CoWoS alternative, reviving IC substrate investment
    The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
    7/81 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook