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NEWS TAGGED CHIPS
Wednesday 28 October 2026
Google TPUs land Oracle, with OpenAI reportedly next
Google's tensor processing unit (TPU) business has gained one confirmed and one reported major customer within a week, adding pressure on Nvidia, whose graphics processors still dominate...
Wednesday 28 October 2026
Unimicron steers resources to Taiwan AI substrates with NT$50.9B equipment orders, Japan unit sale
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Wednesday 28 October 2026
Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek
Anthropic recently disclosed details of its computing partnerships with Google, Amazon Web Services (AWS), Microsoft, Advanced Micro Devices (AMD), and other providers in its S-1 filing...
Tuesday 27 October 2026
Broadcom, financial firms agree on US$63 billion funding for Anthropic chip purchases
Broadcom has reached a deal with several financial firms for them to finance the purchase of US$63 billion worth of its chips for Anthropic. The agreement highlights how the line between...
Tuesday 27 October 2026
Nvidia says GPUs last 8 years, unlocking AI financing
After the GTC Berlin conference, Nvidia CEO Jensen Huang and Silicon Valley technology investor Gavin Baker spoke with Yahoo Finance for about half an hour. Huang confirmed...
Tuesday 27 October 2026
AWS, Google challenge CUDA as AMD, Intel cut AI switch costs
AWS has launched the open-source TorchNeuron tool, allowing developers to port PyTorch artificial intelligence (AI) applications to its custom Trainium chips without rewriting code...
Tuesday 27 October 2026
AI data center boom risks squeezing power chip supplies for auto, electronics
The rapid expansion of AI data centers is driving demand beyond GPUs, memory chips, and advanced packaging. As power consumption in GPU clusters rises, data centers need not only more...
Tuesday 27 October 2026
Anthropic's IPO filing puts TSMC, HBM, direct leasing at the center of AI compute risk
In its preliminary IPO registration statement filed with the US Securities and Exchange Commission, Anthropic describes how much of its capacity depends on a small group of chip and...
Tuesday 27 October 2026
DIGITIMES Insights: AI servers move toward 800V DC as vertical power delivery promises higher efficiency, lower transmission losses
AI server power architectures are evolving toward high-voltage distribution and point-of-load voltage conversion, according to DIGITIMES Intelligence.
Sunday 25 October 2026
Nvidia unveils OOI CPO prototype for post-2028 AI needs
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from...
Friday 23 October 2026
Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions
Israeli security firm Lava identified 32 Nvidia Blackwell Ultra B300 GPUs through monitoring endpoints linked to China Telecom, a state-owned carrier. The chips are barred from sale...
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The...
Friday 23 October 2026
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a...
Friday 23 October 2026
DIGITIMES Insight: BCI grasping reaches market; implant stability and chip heat keep advanced uses beyond 2030
Invasive brain-computer interfaces (BCIs) are demonstrating long-term commercial potential. Neuralink has enabled paralysed patients to control computers and robotic arms through thought;...
Friday 23 October 2026
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
Huawei Technologies has secured a seven-year, CNY15 billion (approx. US$2.3 billion) offshore yuan loan from six Chinese banks, as rising research spending and memory costs weigh on...