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Tuesday 10 November 2026
Nvidia probe fuels push for China chip curbs, raising risks for Samsung, SK Hynix
Samsung Electronics and SK Hynix face uncertainty over demand for high-bandwidth memory (HBM) as US lawmakers press for tighter controls on AI chip exports to China following allegations...
Tuesday 10 November 2026
Exclusive: Designing light for everyone—Wave Photonics seeks to make custom photonic chips accessible
In a Cambridge laboratory, an automated testing machine sits at the end of a process that has traditionally demanded years of specialized engineering: designing a photonic chip, sending...
Tuesday 10 November 2026
Commentary: Why Nvidia's board would struggle to replace Jensen Huang
Nvidia CEO Jensen Huang's personal relationship controversy continues to widen, now spanning US national security, AI chip export controls, and corporate governance.
Tuesday 10 November 2026
South Korea plans first orbital AI data center test for 2028
South Korea plans to develop small, medium, and large data centers in orbit under its K-Moonshot initiative, aiming to conduct its first in-orbit demonstration in 2028 and lay the...
Monday 9 November 2026
Megaspeed chip smuggling probe puts Nvidia NCP certification under scrutiny
Nvidia CEO Jensen Huang appears to have become a target of Chinese intelligence activity, while his admission of an extramarital affair has drawn attention to his relationship with...
Monday 9 November 2026
US-approved Nvidia H200 handlers in China include firms with empty offices and blacklist ties
Washington's case for letting Nvidia sell H200 chips to China rested on case-by-case national-security screening. A New York Times investigation published on November 7 suggests...
Monday 9 November 2026
Musk's Terafab reportedly targets memory output on par with Samsung's DRAM capacity
Terafab, the chipmaking venture backed by Tesla and SpaceX, is reportedly planning memory output that would rival the world's largest DRAM maker. Japanese and Korean equipment and...
Monday 9 November 2026
Surging AI demand turns CoWoS into a headache; securing packaging capacity becomes top priority, says MediaTek deputy GM
Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making...
Monday 9 November 2026
India's semiconductor expansion faces testing capacity risks as OSAT investments advance
India's push to expand semiconductor assembly and packaging capacity risks outpacing the development of its chip testing infrastructure, potentially increasing costs and prolonging...
Monday 9 November 2026
TSMC reaffirms foundry focus after report of 3D DRAM plans for Nvidia
Taiwan Semiconductor Manufacturing Co. (TSMC) has pushed back on a report that it is weighing a move into advanced memory chip manufacturing, saying it remains focused on its contract...
Friday 6 November 2026
US lawmakers request briefing with Nvidia's Jensen Huang on dealings with Megaspeed executive
Three US lawmakers asked Nvidia CEO Jensen Huang to attend a closed-door meeting to discuss his interactions with former Megaspeed executive Alice Huang. The request followed recent...
Friday 6 November 2026
Moonshot AI reportedly seeking access to Nvidia GPUs through European neoclouds
Moonshot AI, a leading Chinese model developer, is reportedly seeking remote access to Nvidia chips held in Europe. With sales of advanced US chips to China limited, the move would...
Friday 6 November 2026
Hua Hong Grace eyes silicon photonics expansion as AI chip shortages lift pricing power
China's second-largest contract chipmaker, Hua Hong Grace Semiconductor, is expanding into silicon photonics and power management chips to capitalise on AI infrastructure demand, following...
Friday 6 November 2026
WT Microelectronics expects AI pull-in momentum to last through 2027
Semiconductor distributor WT Microelectronics expects pull-in momentum from the artificial intelligence (AI) supply chain to remain strong from the fourth quarter of 2026 through 2027...
Friday 6 November 2026
Pluggable optical module forms diverge; rack design emerges as key variable
As switch chips move toward 400G per channel, the gold-finger connectors used in current pluggable modules are approaching their high-frequency limits. The pluggable optics camp introduced...