Samsung signs licensing agreement with YMTC for Hybrid Bonding tech

Jessica Tsai, Taipei; Elaine Chen, DIGITIMES Asia Wednesday 26 February 2025 0

Credit: Samsung

Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology for use in YMTC's next-generation NAND products.

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