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Skytech secures orders for self-developed PLP equipment as OSAT firms adopt CoPoS

Monica Chen, Hsinchu; Kevin Wang, DIGITIMES Asia Monday 8 September 2025 0

Credit: DIGITIMES

Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including outsourced semiconductor assembly and test (OSAT) providers and...

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