Glass substrates edge toward prime time in PCB and chip packaging sector

Flora Wang, Shenzhen

Oct 30, 2025, 06:55 0

Credit: CPCA

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT)...

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