Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout of the Jotunn8 datacenter AI inference processor. Through this partnership, GUC showcased deep capability in complex chiplet architectures and HBM3E integration using 2.5D advanced packaging technology, reinforcing the company's strength in accelerating customer innovation with optimized performance and efficiency.
Jotunn8 is VSORA's flagship AI-inference chip, engineered exclusively for inference workloads rather than training. It delivers ultra-low latency and very high throughput by overcoming the memory wall bottleneck, making large-scale, cost-efficient AI deployment viable.
GUC delivered comprehensive design services for Jotunn8, managing the entire process from netlistin through manufacturing. The solution integrates GUC's Advanced Packaging Technology (APT) IP portfolio, including 17.2 Gbps GLink-2.5D die-to-die interconnect and 8.4 Gbps HBM3E PHY & Controller, leveraging 3x-reticle 2.5D advanced packaging and 5nm process technology.
GUC's contributions included complex physical design, chiplet partitioning and integration, as well as cooptimization of signal, power, and thermal integrity (SI/PI/TI). The team also achieved considerable IR and power optimization, enabling superior power efficiency and overall system performance. This collaboration positions VSORA to meet the demanding compute and bandwidth requirements of hyperscale datacenter inference workloads and underscores GUC's leadership as a trusted partner for AI and HPC ASIC development.
"Jotunn8 is Europe's first HBM-equipped datacenter inference processor, delivering unprecedented
optimization across speed, efficiency, and scalability," said Khaled Maalej, Founder and CEO of VSORA. "GUC's excellence in physical design, die-to-die and HBM IP performance, and advanced packaging expertise played a pivotal role in achieving this milestone tape-out. Their rigorous engineering discipline and collaborative mindset have been instrumental in turning our ambitious vision into silicon reality."
"GUC is honored to help bring VSORA's advanced AI processor to market," said Patrick Wang,
Vice President and Chief Sales Officer at GUC. "VSORA's 2.5D design presented significant technical complexity. By combining their groundbreaking innovations with GUC's engineering excellence in advanced process and packaging technologies, we successfully enabled the Jotunn8 tape-out milestone. We look forward to supporting VSORA's vision for high- performance inference at scale and partnering on future generations of AI processors."
Building on this success, VSORA and GUC are advancing the frontiers of AI compute. By combining deep innovation with execution excellence, the partnership paves the way for a new era of scalable, energy-efficient AI solutions for global data centers.
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