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Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts

Flora Wang, Taipei; Emily Kuo, DIGITIMES Asia Thursday 18 December 2025 0

Credit: DIGITIMES

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more aggressive investment and capacity expansion stance,...

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