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Powertech will invest NT$43.3 billion to accelerate FOPLP, targets mass production in 1H27

Siu Han, Taipei

Jan 28, 2026, 14:55 0

Powertech chairman DK Tsai. Credit: DIGITIMES

In response to growing demand from AI and high-performance computing (HPC) for advanced packaging capacity such as fan-out panel-level packaging (FOPLP), Powertech chairman DK Tsai has outlined breakthroughs in FOPLP technology and expansion plans. After...

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