Semicon China 2026: Siemens EDA pushes agentic AI to cut chip design cycles in half

Joseph Chen, DIGITIMES Asia, Taipei Mar 26, 2026, 12:39, Updated: Mar 26, 2026, 12:42 0

Credit: Digitimes

At the SEMICON China 2026 opening keynote, Siemens EDA IC Products Executive Vice President (EVP) Ankur Gupta delivered a clear message: traditional EDA software is no longer sufficient, and future chip design tools must be AI-driven.

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