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Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster

Jen-Chieh Chiang

Apr 23, 2026, 10:00 0

Credit: AFP

Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging component officially got underway in April 2026 in Chitose City, Hokkaido,...

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