Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant

Levi Li

, DIGITIMES, Taipei

Jun 25, 2026, 10:51 0

Credit: JCET

JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening capacity for AI computing, high-performance chips, high-density...

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