JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift

Scarlett Yu, DIGITIMES, Taipei

Jul 18, 2026, 13:32 0

Credit: JNTC

As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates remain widely used, but rising demand for high-density interconnects, lower...

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