Glass substrates poised to be chip packaging's next battleground: Trumpf

Rebecca Kuo

, Germany

Jul 21, 2026, 07:49 0

Credit: DIGITIMES

AI and high-performance computing are pushing chip packages beyond the limits of conventional materials, and German laser equipment maker Trumpf says that shift could accelerate demand for glass substrates and through-glass vias. The company said 12-inch...

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