Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup

Daniel Chiang, Seoul

Oct 19, 2026, 10:35 0

Hanmi showcases next-generation equipment, including the Wide TC Bonder, at SEDEX 2026. Credit: DIGITIMES

South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027...

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