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Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages

Jessie Lin, Taipei

Oct 29, 2026, 07:51 0

Credit: DIGITIMES

Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking at the 2026 TPCA Show...

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