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Beyond nanometers: AI forces Taiwan's semiconductor ecosystem to compete at system level

Delta Electronics expects 4Q26 to outpace 3Q26 as customer pull-ins drive inventory, profit

Intel increases equipment orders as server demand exceeds supply

Eternal Materials posts record revenue in advanced packaging, precision equipment

Sandisk's data center expansion widens the gap with consumer storage

Analysis: How Oracle’s Cerebras deal is less about dethroning Nvidia than rewiring the AI cloud

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Nvidia secures substrate capacity as FCBGA market targets US$27.3 billion by 2030

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NearLink seeks to expand beyond Huawei ecosystem with chip vendor support

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HBM4 supply cycle may shorten as HBM4E transition accelerates

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US drone program raises edge AI threshold, creating supply-chain opportunities for Taiwan firms

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Analysis: Why Marvell’s rumored Lumentum buy may be hard to pull off but harder to pass up

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Taiflex, E Ink accelerate PTFE development for AI connectivity materials

Angel Liu, Taipei

Oct 30, 2026, 07:57 0

Credit: Taiflex Scientific

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings (EIH) to jointly develop AI high-speed connectivity materials...

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STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO

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